Patents by Inventor Lung-Shan Chuang

Lung-Shan Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package and fabrication method thereof
    Patent number: 10236227
    Abstract: An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: March 19, 2019
    Assignee: Siliconware Prescision Industries Co., Ltd.
    Inventors: Lung-Shan Chuang, Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu
  • Electronic package and fabrication method thereof
    Publication number: 20160260644
    Abstract: An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.
    Type: Application
    Filed: December 24, 2015
    Publication date: September 8, 2016
    Inventors: Lung-Shan Chuang, Ching-Wen Chiang, Tzung-Yen Wu, Chun-Hung Lu