Abstract: A package structure includes a first carrier, a second carrier, and a first electronic device. The first carrier is electrically connected to a first voltage. The second carrier includes a first substrate and a first interconnect structure. The first substrate is in contact with the first carrier, the first interconnect structure is electrically connected to a second voltage, and the first interconnect structure and the first carrier are deposited on two opposite sides of the first substrate. The first electronic device is deposited on the first interconnect structure and away from the first carrier. The first electronic device is in contact with the first interconnect structure.

Abstract: A power device which is formed on a semiconductor substrate includes: plural lateral insulated gate bipolar transistors (LIGBTs) and a forward conductive unit. The plural LIGBTs are connected in parallel to each other. The forward conductive unit is connected in parallel to the plural LIGBTs. The forward conductive unit consists of a PN diode and a Schottky diode connected in parallel to each other. The PN diode and the Schottky diode share a same N-type region, a reverse terminal, an N-type extension region, an field oxide region, a gate, and a P-type well in an epitaxial layer. The N-type region and the P-type well form a PN junction, wherein the PN junction has a staggered comb-teeth interface from top view. A metal line extends on the staggered comb-teeth interface and alternatingly contacts the N-type region and the P-type well.

Abstract: A power device which is formed on a semiconductor substrate includes: a lateral insulated gate bipolar transistor (LIGBT), a PN diode and a clamp diode. The PN diode is connected in parallel to the LIGBT. The clamp diode has a clamp forward terminal and a clamp reverse terminal, which are electrically connected to a drain and a gate of the LIGBT, to clamp a gate voltage applied to the gate not to be higher than a predetermined voltage threshold.

Abstract: An intelligent power module, which includes: a lead frame; a plurality of signal processing chips, disposed on the lead frame; at least one bridge die, configured to operably transmit signals among the signal processing chips; and a package structure, encapsulating the lead frame, the signal processing chips and the bridge die.

Abstract: An intelligent power module includes: an encapsulating material structure; a lead frame which is at least partially encapsulated inside the encapsulating material structure, wherein all portions of the lead frame encapsulated inside the encapsulating material structure are at a same planar level; and a heat dissipation structure, which is connected to the lead frame.

Abstract: A power device which is formed on a semiconductor substrate includes: a lateral insulated gate bipolar transistor (LIGBT), a PN diode and a clamp diode. The PN diode is connected in parallel to the LIGBT. The clamp diode has a clamp forward terminal and a clamp reverse terminal, which are electrically connected to a drain and a gate of the LIGBT, to clamp a gate voltage applied to the gate not to be higher than a predetermined voltage threshold.

Abstract: A power device which is formed on a semiconductor substrate includes: plural lateral insulated gate bipolar transistors (LIGBTs) and a forward conductive unit. The plural LIGBTs are connected in parallel to each other. The forward conductive unit is connected in parallel to the plural LIGBTs. The forward conductive unit consists of a PN diode and a Schottky diode connected in parallel to each other. The PN diode and the Schottky diode share a same N-type region, a reverse terminal, an N-type extension region, an field oxide region, a gate, and a P-type well in an epitaxial layer. The N-type region and the P-type well form a PN junction, wherein the PN junction has a staggered comb-teeth interface from top view. A metal line extends on the staggered comb-teeth interface and alternatingly contacts the N-type region and the P-type well.

Abstract: An optical element of a lighting device and a design method of the same are revealed. The optical element is used together with a LED lighting part. The design method includes steps of providing a LED lighting part, selecting a suitable equation used in describing curves and surfaces for simulation test, substituting and changing a plurality of parameters in the equation to run simulation test of the light emitted from the LED lighting part for determining curves and surfaces of the incident surface and the emission surface that satisfy requirements of a specific light distribution pattern. The optical element features on that an air gap is between the incident surface and the LED lighting part. The slope of the incident surface and the slope of the emission surface are of opposite signs on the X-Z surface that passes the origin and ? angle is within 80 degrees around an optical axis of the LED lighting part.

Abstract: An optical member of lighting device is revealed. The optical member consists at least one emergent surface that is a spherical surface or an aspherical surface, and at least one incident surface with a V-shaped groove or a V-shaped like groove. The V-shaped groove is formed by two symmetrical or asymmetrical slants while the V-shaped like groove is formed by a plurality of curves. Moreover, axes of the emergent surface and the incident surface can be overlapped, shift relatively, slanted relatively to each other or combinations of them. When the optical member is used in combination with at least one solid state lighting element, an asymmetrical batwing light distribution pattern that features on non-zero maximum light intensity is generated. Thus the area being emitted is with uniform luminance and the availability of light is improved.

Abstract: A lens device used for an LED package includes a base portion, and a refracting portion formed on the top face of the base portion. A recess corresponding to the refracting portion is formed on the bottom face of the base portion. At least one notch connecting with the recess is also formed on the bottom face of the base portion. A surface of refracting portion is provided as a non-spherical convex surface. An indent is formed on the center of the non-spherical convex surface. The light emitted from the LED package is directed toward lateral side, and the angular intensity distribution has an asymmetrical batwing shape, so as to obtain an illuminating apparatus with uniformly illumination.