Abstract: The method of the present disclosure includes steps of: (S1) providing a silicon substrate; (S2) arranging and disposing an active component layer by utilizing a first type photomask on at least two high-precision regions of each of a plurality of inkjet print head chip regions on the silicon substrate; (S3) arranging and disposing a passive component layer by utilizing a second type photomask on the active component layer; and (S4) cutting the silicon substrate according to the inkjet print head chip regions so as to form the plurality of narrow type inkjet print head chips.

Abstract: A heterogeneous integration chip of a micro fluid actuator is disclosed and includes a first substrate, a first insulation layer, a first conductive layer, a piezoelectric layer, a second conductive layer, a second substrate, a control element, a perforated trench and a conductor. The first substrate includes a first chamber. The first insulation layer is disposed on the first substrate. The first conductive layer is disposed on the first insulation layer and includes an electrode pad. The piezoelectric layer and the second conductive layer are stacked on the first conductive layer sequentially. The second substrate is assembled to the first substrate through a bonding layer to define a second chamber and includes an orifice, a fluid flowing channel and a third chamber. The control element is disposed in the second substrate. The perforated trench filled with the conductor is penetrated from the electrode pad to the second substrate.

Abstract: A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.

Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt. % to about 10 wt. % silica abrasive; (b) an anionic polymer having a weight average molecular weight of about 400 kDa to about 7000 kDa; and (c) water, wherein the polishing composition has a viscosity of at least about 1 cPs, a ratio of viscosity (cPs) to wt. % of silica abrasive of about 0.2 cPs/wt. % to about 1.5 cPs/wt. %, and a pH of about 9 to about 12. The invention additional provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt. % to about 10 wt. % silica abrasive; (b) a nonionicpolymer having a weight average molecular weight of about 300 kDa to about 7000 kDa; and (c) water, wherein the polishing composition has a viscosity of at least about 2 cPs, and a pH of about 9 to about 12.

Abstract: A chemical mechanical polishing composition for polishing a substrate including a silicon carbonitride layer, the composition comprising, consisting essentially of, or consisting of a water based liquid carrier, anionic colloidal silica particles dispersed in the liquid carrier, a topography control agent, and having a pH in a range from about 2 to about 7.

Abstract: A dual-trajectory pedicle screw system includes an internally threaded sleeve and including first part and cylindrical second part, the first part being recessed to form a space, and the second part including projections on top; a main screw including a universal head and a first conic member, the universal head including first and second threaded holes, the first threaded hole being inclined at a first angle, the second threaded hole being inclined at a different second angle, bottom of the universal head being a convex and rotatably disposed in the space; and an auxiliary screw including external threads threadedly secured to the first or second threaded hole so that the auxiliary screw is secured to the main screw at the first or second angle with respect to the main screw, a second conic member extending downward from the external threads, and a fitting member on top of the external threads.

Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising silica particles and alumina particles, wherein the alumina particles are surface-coated with an anionic polymer, and (b) water. The invention also provides a method of chemically mechanically polishing a substrate, especially a substrate comprising tungsten, silicon oxide, and nitride, with the polishing composition.

Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) about 0.05 wt. % to about 10 wt. % of an abrasive; (b) a dispersant, wherein the dispersant is a linear or branched C2-C10 alkylenediol; and (c) water, wherein the chemical-mechanical polishing composition has a pH of about 2 to about 6. The invention also provides a method of chemically-mechanically polishing a substrate by contacting the substrate with the inventive chemical-mechanical polishing composition.

Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tube, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.

Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tube, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.

Abstract: An apparatus, for reinforcing bone and tools for mounting the same, has an implant including a barrel and a device. The implant can be expanded by an expanding apparatus including an outer tub, a base, a hollow body and a handle. The expanding apparatus can be bound to the implant to place the implant into a bone to be treated and adjust the expansion degree. The expanding apparatus can be replaced by an injector apparatus including a container for bone cement and an injecting handle. The injector apparatus can inject a mixture for reinforcing bone (e.g., bone cement) into the bone through an exit, the device, the aperture, the barrel and the window of the barrel, and into the to-be treated area.

Abstract: A driving method for a spindle motor and associated driving system and apparatus are provided. The driving method includes the following steps. Plural modulation signals and plural floating phases corresponding to the plural modulation signals are adjusted. A floating period comes immediately after an active period of each of the plural modulation signals according to the plural floating phases. During the floating period, a demagnetization time of the spindle motor is acquired according to a first terminal voltage signal at a first terminal of the spindle motor. If the demagnetization time is not smaller than the threshold time period, the step of adjusting the plural modulation signals is repeatedly done. Whereas, if the demagnetization time is smaller than the threshold time period, after the demagnetization time, a phase of the spindle motor is obtained according to the first terminal voltage signal.

Abstract: A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.

Abstract: A driving method for a spindle motor and associated driving system and apparatus are provided. The driving method includes the following steps. Plural modulation signals and plural floating phases corresponding to the plural modulation signals are adjusted. A floating period comes immediately after an active period of each of the plural modulation signals according to the plural floating phases. During the floating period, a demagnetization time of the spindle motor is acquired according to a first terminal voltage signal at a first terminal of the spindle motor. If the demagnetization time is not smaller than the threshold time period, the step of adjusting the plural modulation signals is repeatedly done. Whereas, if the demagnetization time is smaller than the threshold time period, after the demagnetization time, a phase of the spindle motor is obtained according to the first terminal voltage signal.

Abstract: An electronic device includes a housing and a display module received in the housing. The display module includes a display panel, a touch panel positioned on the display panel, a light guide plate positioned on the touch panel, a light source positioned at a side of the light guide plate, and a hardened layer positioned on the light guide plate. The light guide plate and the display panel are respectively positioned at opposite sides of the touch panel. The hardened layer covers a surface of the light guide plate away from the touch panel.

Abstract: An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a material of the sealing metal layer includes AgSn and is lead-free.

Abstract: Provided herein are a TV program-based shopping guide system and a TV program-based shopping guide method. The TV program-based shopping guide system includes a detecting module, an expansion module and a recommendation module. The detecting module provides a plurality of key nouns according to program information corresponding to a TV program that a user is watching. The expansion module searches in at least one social network provided with a plurality of web articles according to the key nouns to obtain a plurality of expansion nouns. Each of the expansion nouns corresponds to one of the key nouns. The recommendation module searches in a commodity database according to the key nouns and the expansion nouns to obtain a matched commodity list, and then outputs information related to a plurality of recommended commodities included in the matched commodity list to at least one electronic device.

Abstract: A method of planarizing/polishing germanium is described. The method comprises the step of abrading the surface of a substrate comprising germanium with an aqueous chemical mechanical polishing (CMP) composition comprising an oxidizing agent, a particulate abrasive, and a germanium etching inhibitor. The germanium etching inhibit is selected from the group consisting of a water-soluble polymer, an amino acid having a non-acidic side chain, a bis-pyridine compound, and a combination of two or more thereof. The polymer can be a cationic or nonionic polymer that comprises basic nitrogen groups, amide groups, or a combination thereof.