Patents by Inventor Lung Yuan Pan
Lung Yuan Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230282476Abstract: In some embodiments, the present disclosure relates to a semiconductor device, including a substrate including a first semiconductor material and a semiconductor layer extending into an upper surface of the substrate and including a second semiconductor material with a different band gap than the first semiconductor material. The semiconductor device also includes a passive cap including a first dielectric material and disposed along the upper surface of the substrate and on opposite sides of the semiconductor layer, and a photodetector in the semiconductor layer. The first dielectric material includes silicon nitride.Type: ApplicationFiled: March 1, 2022Publication date: September 7, 2023Inventors: Lung Yuan Pan, Chen-Hao Chiang, Chih-Ming Chen
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Publication number: 20230275012Abstract: Various embodiments of the present disclosure are directed towards an apparatus comprising a semiconductor substrate. A conductive pillar is disposed in the semiconductor substrate. An isolation region is disposed in the semiconductor substrate and extends laterally around the conductive pillar. The isolation region is configured to electrically isolate the conductive pillar from a surrounding portion of the semiconductor substrate. An opening is disposed in the isolation region. A dielectric anchor is disposed in the isolation region. The dielectric anchor extends vertically through the semiconductor substrate along a side of the opening. The dielectric anchor anchors the conductive pillar to the semiconductor substrate.Type: ApplicationFiled: February 28, 2022Publication date: August 31, 2023Inventor: Lung Yuan Pan
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Publication number: 20220311357Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.Type: ApplicationFiled: June 16, 2022Publication date: September 29, 2022Inventors: Chiao-Chun Hsu, Chih-Ming Chen, Chung-Yi Yu, Lung Yuan Pan
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Patent number: 11387748Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.Type: GrantFiled: February 26, 2020Date of Patent: July 12, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiao-Chun Hsu, Chih-Ming Chen, Chung-Yi Yu, Lung Yuan Pan
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Patent number: 11130670Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: GrantFiled: April 22, 2019Date of Patent: September 28, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Ying Tsai, Hung-Hua Lin, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang
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Publication number: 20210067058Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.Type: ApplicationFiled: February 26, 2020Publication date: March 4, 2021Inventors: Chiao-Chun Hsu, Chih-Ming Chen, Chung-Yi Yu, Lung Yuan Pan
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Publication number: 20190248646Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: ApplicationFiled: April 22, 2019Publication date: August 15, 2019Inventors: Shang-Ying Tsai, Hung-Hua Lin, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Yao-Te Huang
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Patent number: 10266390Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: GrantFiled: October 28, 2015Date of Patent: April 23, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Ying Tsai, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Hung-Hua Lin, Yao-Te Huang
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Patent number: 10269637Abstract: A semiconductor structure includes a substrate, a hole which includes a top hole and a bottom hole in communication with each other in the substrate, and a filler in the top hole and the bottom hole, wherein the top hole tapers toward the bottom hole, and a side surface of the top hole and a side surface of the bottom hole form an obtuse angle.Type: GrantFiled: July 7, 2017Date of Patent: April 23, 2019Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Lee-Chuan Tseng, Lung-Yuan Pan, Chung-Yen Chou
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Publication number: 20180158732Abstract: A semiconductor structure includes a substrate, a hole which includes a top hole and a bottom hole in communication with each other in the substrate, and a filler in the top hole and the bottom hole, wherein the top hole tapers toward the bottom hole, and a side surface of the top hole and a side surface of the bottom hole form an obtuse angle.Type: ApplicationFiled: July 7, 2017Publication date: June 7, 2018Inventors: Lee-Chuan TSENG, Lung-Yuan PAN, Chung-Yen CHOU
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Publication number: 20160046482Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: ApplicationFiled: October 28, 2015Publication date: February 18, 2016Inventors: Hung-Hua Lin, Hsin-Ting Huang, Lung Yuan Pan, Jung-Huei Peng, Shang-Ying Tsai, Yao-Te Huang
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Patent number: 9181083Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: GrantFiled: September 12, 2014Date of Patent: November 10, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Ying Tsai, Hung-Hua Lin, Lung Yuan Pan, Yao-Te Huang, Hsin-Ting Huang, Jung-Huei Peng
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Publication number: 20150031159Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: ApplicationFiled: September 12, 2014Publication date: January 29, 2015Inventors: Shang-Ying Tsai, Hung-Hua Lin, Lung Yuan Pan, Yao-Te Huang, Hsin-Ting Huang, Jung-Huei Peng
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Patent number: 8853801Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: GrantFiled: April 19, 2012Date of Patent: October 7, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin
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Patent number: 8836055Abstract: A device includes a micro-electro-mechanical system (MEMS) device, which includes a movable element and a fixed element. The movable element and the fixed element form two capacitor plates of a capacitor, with an air-gap between the movable element and the fixed element acting as a capacitor insulator of the capacitor. At least one of the movable element and the fixed element has a rugged surface.Type: GrantFiled: September 30, 2011Date of Patent: September 16, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Lung Yuan Pan, Lan-Lin Chao, Chia-Shiung Tsai
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Publication number: 20130277770Abstract: A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.Type: ApplicationFiled: April 19, 2012Publication date: October 24, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shang-Ying Tsai, Jung-Huei Peng, Hsin-Ting Huang, Yao-Te Huang, Lung Yuan Pan, Hung-Hua Lin
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Publication number: 20130082338Abstract: A device includes a micro-electro-mechanical system (MEMS) device, which includes a movable element and a fixed element. The movable element and the fixed element form two capacitor plates of a capacitor, with an air-gap between the movable element and the fixed element acting as a capacitor insulator of the capacitor. At least one of the movable element and the fixed element has a rugged surface.Type: ApplicationFiled: September 30, 2011Publication date: April 4, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Lung Yuan Pan, Lan-Lin Chao, Chia-Shiung Tsai