Abstract: An apparatus may include a sense amplifier with a single column select transistor, a local input/output line selectively couplable to a first bit line through the column select transistor, and a read/write gap comprising at least a first transistor and a second transistor. The first transistor may be couplable to a read select signal and a complimentary local input/output line and the second transistor is couplable to the complimentary local input/output line and a global input/output line.

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

Abstract: Apparatuses, systems, and methods for single-ended global and local input/output architecture. A conventional memory may use local input/output (LIO) and global input/output (GIO) lines which are paired and carry complimentary signals. The present disclosure includes single ended LIO and GIO architecture where a single LIO couples a single GIO between a read/write amplifier and bit line as part of an access operation. This may reduce a footprint of the memory device.

Abstract: Semiconductor die assemblies with decomposable materials, and associated methods and systems are disclosed. In an embodiment, a semiconductor die assembly includes a memory controller die carrying one or more memory dies attached to its first side. The semiconductor die assembly also includes a biodegradable structure attached to its second side opposite to the first side. The biodegradable structure includes a conductive material and an insulating material, both of which are biodegradable and disintegrate in a wet process. The biodegradable structure can be configured to couple the memory controller die with an interface die. In this manner, when the biodegradable structure disintegrates (e.g., dissolve) in the wet process, the memory controller carrying the memory dies can be separated from the interface die to reclaim the memory controller with the memory dies and the interface die.

Abstract: Apparatuses, systems, and methods for single-ended global and local input/output architecture. A conventional memory may use local input/output (LIO) and global input/output (GIO) lines which are paired and carry complimentary signals. The present disclosure includes single ended LIO and GIO architecture where a single LIO couples a single GIO between a read/write amplifier and bit line as part of an access operation. This may reduce a footprint of the memory device.