Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

Abstract: A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a novel combination of a metal oxide compound to promote adhesion and a transition metal plating catalyst compound promoting the metal layer formation.

Abstract: A method is provided for metallisation of non-conductive substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies a metal oxide adhesion promoter which is activated and then metal plated. The method provides high adhesion of the non-conductive substrate to the plated metal layer.

Abstract: The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact.

Abstract: A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

Abstract: The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.

Abstract: The present invention describes a method for the measurement of the stabilizer additive concentration in electroless metal and metal alloy plating electrolytes comprising a voltammetric measurement. Said method comprises the steps a. conditioning of the working electrode, b. interaction of intermediates on the working electrode, c. measurement of the Faradaic current and d. determining the Faradaic current.

Abstract: A method for cost-effectively producing thermoelectric elements and thermoelectric modules with a multitude of thermoelectric couples is disclosed. This method makes the fabrication of very small size thermoelectric elements and miniaturized, compact, powerful thermoelectric modules possible. Methods of the present invention can be also used to fabricate integrated thermoelectric modules in electrical or other devices. The invented method is based on an additive technology using thermoelectric pastes and a patternable insulator layer. Layers of conductive traces are first fabricated on the two insulating planes. A patternable insulator layer is formed and filled with P- and N-type thermoelectric pastes. The thermoelectric elements are formed during the curing or sintering of the thermoelectric pastes. Sizes and positions of the thermoelectric elements are defined by the patterned insulator layer.

Abstract: In accordance with the present invention, there are provided novel metal-containing compositions useful for the preparation of electrical resistance devices (e.g., resistors and thermistor elements). Compositions according to the invention comprise at least one low melting point metal material, and optionally a higher melting point metal material, with the further presence of a binder system also being optional. Compositions according to the invention exhibit a wide range of resistivity and a wide range of values for temperature coefficient of resistance (TCR). Compositions with low values for TCR are useful for resistor applications while compositions with large values for TCR are useful for thermistor applications. Resistor or thermistor elements can be produced by applying compositions according to the invention onto suitable substrates and subsequently alloying (i.e., curing and/or sintering) the compositions.

Abstract: In accordance with the present invention, it has been discovered that conductive traces made from transient liquid phase sintering (TLPS) pastes, plated by electroless or electrolytic means, result in improved solderability, adhesion and conductivity of the circuitry. Transient liquid phase sintering pastes employed in the practice of the present invention differ from conventional metal loaded polymer thick film (PTF) inks in that they contain, in addition to a binder, they also contain both a relatively high melting metal powder and a relatively low melting solder powder capable of forming a continuous intermetallic/metallic phase after sintering. The present invention is particularly useful, for example, for the fabrication of single and multi-layer printed circuit boards, providing horizontal and vertical conductive interconnects, metallized through-holes, and conductive pads for electronic component attachment.

Abstract: A polymeric coating agent which comprises a polymer of from 60 to 97 wt. % of one or more (meth)acrylic monomers the polymerization of which can be initiated by free radicals, from 3 to 40 wt. % of at least one .alpha., .omega.-hydroxy-, carboxy-, and/or epoxy-functional polysiloxanes of the formula (I) ##STR1## wherein R' can be the same or different and is C.sub.1-6 alkyl, and R can be the same or different and is ##STR2## wherein Alk and Alk' are C.sub.1-6 alkylene and the alkylene groups in a molecule can be the same or different, n is a cardinal number from 8 to 40, m is a cardinal number from 2 to 30, and p is a cardinal number from 1 to 20 of solids in the monomers.

Abstract: Flat, transparent slabs of vitreous silica of optical quality are produced by melting granular starting material in a vacuum by means of an electrical heating system. The starting material is melted while sustaining a heat flow from the top to the bottom of the crucible. The bottom of the crucible is made permeable to gases. The heat isolation power of the crucible wall increases from the bottom to the top of the crucible.

Abstract: Flat, transparent slabs of vitreous silica of optical quality are produced by melting granular starting material in a vacuum by means of an electrical heating system. The starting material is melted while sustaining a heat flow from the top to the bottom of the crucible. The bottom of the crucible is made permeable to gases. The heat isolation power of the crucible wall increases from the bottom to the top of the crucible.