Patents by Inventor Lutz Hoeppel

Lutz Hoeppel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250047066
    Abstract: A surface emitting semiconductor laser is disclosed that includes a semiconductor layer sequence having an active layer for generating laser radiation, a carrier substrate on one side of the semiconductor layer sequence, and an optical structure for influencing at least one degree of freedom of the laser radiation. The carrier substrate is different from a growth substrate of the semiconductor layer sequence and the growth substrate is at least partly removed. The optical structure has a varying refractive index in a lateral direction for the laser radiation.
    Type: Application
    Filed: November 2, 2022
    Publication date: February 6, 2025
    Applicant: ams-OSRAM International GmbH
    Inventors: Hubert HALBRITTER, Bruno JENTZSCH, Adrian Stefan AVRAMESCU, Laura KREINER, Lutz HÖPPEL, Christoph EICHLER
  • Publication number: 20250048784
    Abstract: In embodiments a method includes providing a functional semiconductor layer stack and depositing a first material on the surface, in particular a transition element oxide. A structured hard mask stack is deposited on the first material, wherein the structured hard mask stack includes a first layer and at least a second layer on the first layer with sidewalls of at least the first layer covered by a second material, wherein the second layer and the second material are resilient against a wet chemical etching process. Two anisotropic dry chemical etching processes and a wet etching process is performed to provide a deep mesa structure in the functional layer stack, wherein the second layer protects the first layer during the wet etching process.
    Type: Application
    Filed: December 10, 2021
    Publication date: February 6, 2025
    Inventors: Lutz Hoeppel, André Steiner, Vesna Mueller, Markus Heyne, Tobias Meyer
  • Publication number: 20240332901
    Abstract: The invention relates to a surface-emitting semiconductor laser, including a first semiconductor layer of a first conductivity type, the first semiconductor layer being structured forming a mesa, an active zone for generating electromagnetic radiation and a second semiconductor layer of a second conductivity type. The first semiconductor layer, the active zone and the second semiconductor layer are arranged on top of one another forming a semiconductor layer stack. The surface-emitting semiconductor laser further comprises a sheath layer which adjoins a lateral wall of the mesa.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 3, 2024
    Applicant: AMS-OSRAM International GmbH
    Inventors: Hubert HALBRITTER, Lutz HOEPPEL, Sven GERHARD
  • Patent number: 12087893
    Abstract: An optoelectronic semiconductor device may include a carrier having a roughened first main surface and optoelectronic semiconductor chips arranged over the roughened first main surface. The combined surface area of the optoelectronic semiconductor chips is smaller than the surface area of the carrier, and a part of the roughened first main surface is arranged between adjacent optoelectronic semiconductor chips.
    Type: Grant
    Filed: March 16, 2020
    Date of Patent: September 10, 2024
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Lutz Hoeppel, Attila Molnar
  • Publication number: 20240186460
    Abstract: A component includes a carrier, at least one semiconductor chip, an intermediate layer and a cover layer. The semiconductor chip, the intermediate layer and the cover layer are arranged on the carrier. The cover layer has at least one cavity wherein the semiconductor chip is arranged. The intermediate layer is electrically insulating and is arranged in regions along the vertical direction between the carrier and the cover layer. The intermediate layer extends along lateral direction into the cavity and adjoins the semiconductor chip. The cover layer has a vertical height that varies depending on the lateral positions of the cover layer and has a reduced vertical height at the positions of the intermediate layer.
    Type: Application
    Filed: April 5, 2022
    Publication date: June 6, 2024
    Inventor: Lutz HÖPPEL
  • Publication number: 20230084844
    Abstract: An optoelectronic semiconductor device may include a carrier comprising a patterned surface and a semiconductor layer sequence arranged on the carrier. The semiconductor layer sequence may include a first semiconductor layer having a first surface, a second semiconductor layer having a first surface, and a first main surface and a second main surface opposite the first main surface. The first surfaces of the first and second semiconductor layers may be at least partly arranged at the first main surface. The second main surface may face the patterned surface of the carrier, and at least one side face may connect the first and second main surfaces. The device may further include a directionally reflective layer and a planarization layer. The planarization layer may be arranged between the patterned surface and the directionally reflective layer. Moreover, a method for producing an optoelectronic semiconductor device is also disclosed.
    Type: Application
    Filed: February 17, 2021
    Publication date: March 16, 2023
    Inventors: Fabian KOPP, Attila MOLNAR, Lutz HOEPPEL
  • Patent number: 11527521
    Abstract: In an embodiment a composite semiconductor component includes a carrier substrate having a plurality of projecting elements projecting from a first main surface of the carrier substrate, an electrically conductive material electrically conductively connected to a contact region of the carrier substrate and located on at least one of the projecting elements, some of the projecting elements not being covered with the electrically conductive material and a semiconductor chip arranged on the carrier substrate and having at a first surface at least one contact pad electrically connected to the electrically conductive material on at least one element, wherein, at a position at which the contact pad and the electrically conductive material on the projecting element are in each case in contact with one another, the contact pad has a larger lateral extent than the projecting element in each case.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: December 13, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Lutz Hoeppel, Alexander Pfeuffer
  • Patent number: 11404402
    Abstract: A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: August 2, 2022
    Assignee: OSRAM OLED GmbH
    Inventors: Tilman Rügheimer, Thomas Schwarz, Lutz Höppel, Andreas Plößl, Alexander F. Pfeuffer
  • Publication number: 20220238773
    Abstract: In an embodiment a method for producing a component having a carrier and at least one component part electrically conductively connected to the carrier and mechanically fixed to the carrier by an electrically insulating bonding layer includes providing the carrier having a connection layer, wherein the bonding layer is disposed on the carrier and has at least one opening, wherein a connection surface of the connection layer is exposed, and wherein the bonding layer projects vertically beyond the exposed connection surface or vice versa, applying the component part having a contact layer on the carrier in such that, in top view of the carrier, an exposed contact surface of the contact layer covers the opening and the connection surface located therein, wherein the exposed contact surface is spaced apart from the exposed connection surface by a vertical distance and reducing the vertical distance by changing a volume of the bonding layer such that the exposed contact surface and the exposed connection surface a
    Type: Application
    Filed: May 6, 2020
    Publication date: July 28, 2022
    Inventors: Alexander F. Pfeuffer, Tobias Berthold, Lutz Höppel, Tobias Meyer, Korbinian Perzlmaier
  • Publication number: 20220149256
    Abstract: An optoelectronic semiconductor device may include a carrier having a roughened first main surface and optoelectronic semiconductor chips arranged over the roughened first main surface. The combined surface area of the optoelectronic semiconductor chips is smaller than the surface area of the carrier, and a part of the roughened first main surface is arranged between adjacent optoelectronic semiconductor chips.
    Type: Application
    Filed: March 16, 2020
    Publication date: May 12, 2022
    Inventors: Lutz HOEPPEL, Attila MOLNAR
  • Patent number: 11251081
    Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 15, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
  • Publication number: 20210351323
    Abstract: A component may have a semiconductor body, a first electrode, and a second electrode. The first electrode and the second electrode may be configured for electrically contacting a first semiconductor layer and a second semiconductor, respectively, and may have a first distribution track and a second distribution track for uniformly distributing current in the first semiconductor layer and the second semiconductor layer, respectively. The first distribution track and the second distribution track may be arranged regionally one above the other on the same side of the semiconductor body, overlap each other regionally in top view, and cover the semiconductor body only in certain places. Furthermore, the first distribution track may extend in places throughout the second semiconductor layer and the active zone to the first semiconductor layer. The active zone may be removed only in places in overlapping regions of the semiconductor body and the first distribution track.
    Type: Application
    Filed: September 27, 2019
    Publication date: November 11, 2021
    Inventor: Lutz HOEPPEL
  • Patent number: 11101249
    Abstract: In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: August 24, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Frank Singer, Jürgen Moosburger, Thomas Schwarz, Lutz Hoeppel, Matthias Sabathil
  • Patent number: 11088297
    Abstract: A method for producing a component and a component are disclosed. In an embodiment a method includes providing a substrate, applying a composite of components to the substrate, forming an anchoring layer on the composite of components, attaching a carrier to the anchoring layer, wherein the anchoring layer is disposed between the substrate and the carrier and removing the substrate, wherein the composite of components is divided into a plurality of components by forming a plurality of separating trenches, wherein, after removing the substrate, the components continue to be held on the carrier by the anchoring layer, and wherein the anchoring layer comprises at least one predetermined breaking layer having at least one predetermined breaking position, the predetermined breaking position being laterally surrounded by the separating trenches and—in a plan view of the carrier—being covered by one of the components.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 10, 2021
    Assignee: OSRAM OLED GMBH
    Inventor: Lutz Höppel
  • Publication number: 20210183834
    Abstract: A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is between the electrical devices of a same component. The at least two electrical devices of the same component are arranged next to one another and enclosed laterally by the insulating layer. The at least two electrical devices and the insulating layer of the same component are integral parts of a self-supporting and mechanically stable unit. The self-supporting and mechanically stable unit and the anchoring elements fix the positions of the components on the intermediate carrier. The components that are self-supporting and mechanically stable units are detachable from the intermediate carrier, and the anchoring elements release the components under mechanical load when the latter are removed.
    Type: Application
    Filed: November 6, 2018
    Publication date: June 17, 2021
    Inventors: Tilman RÜGHEIMER, Thomas SCHWARZ, Lutz HÖPPEL, Andreas PLÖßL, Alexander F. PFEUFFER
  • Patent number: 10985292
    Abstract: A method for transferring semiconductor bodies and a semiconductor chip are disclosed.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: April 20, 2021
    Assignee: OSRAM OLED GMBH
    Inventor: Lutz Höppel
  • Publication number: 20200411493
    Abstract: In an embodiment a composite semiconductor component includes a carrier substrate having a plurality of projecting elements projecting from a first main surface of the carrier substrate, an electrically conductive material electrically conductively connected to a contact region of the carrier substrate and located on at least one of the projecting elements, some of the projecting elements not being covered with the electrically conductive material and a semiconductor chip arranged on the carrier substrate and having at a first surface at least one contact pad electrically connected to the electrically conductive material on at least one element, wherein, at a position at which the contact pad and the electrically conductive material on the projecting element are in each case in contact with one another, the contact pad has a larger lateral extent than the projecting element in each case.
    Type: Application
    Filed: February 14, 2019
    Publication date: December 31, 2020
    Inventors: Lutz Hoeppel, Alexander Pfeuffer
  • Patent number: 10879426
    Abstract: A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: December 29, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Lutz Hoeppel, Matthias Sabathil, Norwin Von Malm
  • Publication number: 20200350207
    Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.
    Type: Application
    Filed: October 25, 2018
    Publication date: November 5, 2020
    Inventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
  • Patent number: 10784408
    Abstract: An optoelectronic semiconductor chip includes a semiconductor body including a first semiconductor region, a second semiconductor region and an active zone disposed between the first and second semiconductor regions, an electrically conductive contact layer arranged on a side of the first semiconductor region facing away from the second semiconductor region, and an electrically conductive mirror layer arranged between the first semiconductor region and the electrically conductive contact layer, and laterally protruding at the edge by the first semiconductor region and the electrically conductive contact layer so that between the first semiconductor region and the electrically conductive contact layer there is an interspace in which a protective layer is arranged for protecting the mirror layer, wherein the electrically conductive contact layer extends laterally to an edge of the first semiconductor region, and the electrically conductive contact layer consists of Ni.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: September 22, 2020
    Assignee: OSRAM OLED GmbH
    Inventor: Lutz Höppel