Abstract: A method is provided for non-contact interaction with a module, the module including a first submodule and a second submodule, a primary beam being generated by the first submodule in a first method step, the primary beam being deflected by the second submodule in a second method step in such a way that a piece of image information is projected onto a projection area, the primary beam being deflected by the second submodule in a third method step in such a way that a piece of operating information is projected onto an operating area, a control signal being generated by the module in a fourth method step if a control command is detected in a locating zone associated with the primary beam, the operating area being projected onto an operating object in the third method step if the operating object is positioned in the locating zone.

Abstract: A light source device, in particular for use in a micromirror device, having a first red light source for the emission of light from the red spectral range, a second red light source for the emission of light from the red spectral range, a green light source for the emission of light from the green spectral range, and a blue light source for the emission of light from the blue spectral range, and having superposition element, the superposition element being configured such that the light from the first red light source, the light from the second red light source, the light from the blue light source, and the light from the green light source are superposed in collinear fashion to form a common light beam, the light from the first red light source having a wavelength different from that of the light from the second red light source.

Abstract: A method for determining gestures in the beam region of a projector includes: projecting an image onto a surface with the aid of the projector, using light; measuring a first set of light intensities of light backscattered from the direction of the surface, under the influence of a gesture made in the beam region of the projector; assigning the measured light intensities to, in each instance, a position of the image projected by the projector; at a first time point, generating a first light intensity function over a second set of positions, which are assigned measured light intensities; at a second time point, generating at least one second light intensity function over the second set of positions; and determining the gesture made, based on the result of a comparison between the first and second light intensity functions.

Abstract: A multi-laser projection device includes: a plurality of first assemblies, each including a fixed assemblage of a respective laser diode and an associated first collimator lens; a second assembly that forms a fixed assemblage of a beam combiner and a respective second collimator lens that is fastened on an entry surface of the beam combiner and that appertains to a respective laser diode; and a deflection unit. The plurality of first assemblies, the second assembly, and the deflection unit are mounted in a common housing so as to be adjusted to one another.

Abstract: A mobile microprojector is provided to include at least one deflectable micromirror for scanning a projection surface with the aid of a light beam, as well as a control unit for controlling the movements of the micromirror, the control unit being configured to effectuate at least one deflection of the micromirror via a first amplitude in a first operating state for scanning the projection surface. The control unit is configured to effectuate the deflection of the micromirror via a second amplitude in a second operating state, the second amplitude being smaller than the first amplitude.

Abstract: A multi-laser projection device includes: a plurality of first assemblies, each including a fixed assemblage of a respective laser diode and an associated first collimator lens; a second assembly that forms a fixed assemblage of a beam combiner and a respective second collimator lens that is fastened on an entry surface of the beam combiner and that appertains to a respective laser diode; and a deflection unit. The plurality of first assemblies, the second assembly, and the deflection unit are mounted in a common housing so as to be adjusted to one another.

Abstract: A method for determining gestures in the beam region of a projector includes: projecting an image onto a surface with the aid of the projector, using light; measuring a first set of light intensities of light backscattered from the direction of the surface, under the influence of a gesture made in the beam region of the projector; assigning the measured light intensities to, in each instance, a position of the image projected by the projector; at a first time point, generating a first light intensity function over a second set of positions, which are assigned measured light intensities; at a second time point, generating at least one second light intensity function over the second set of positions; and determining the gesture made, based on the result of a comparison between the first and second light intensity functions.

Abstract: A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: Measures are introduced to make possible a low-cost packaging of sensor chips having a media access. For this purpose, the sensor chip is first mounted on a substrate and is contacted. The sensor chip is then at least partially embedded in a molding compound. Finally, at least one portion of the media access is produced by the subsequent structuring of the molding compound.

Abstract: A semiconductor chip having contact surfaces on an upper side parallel to the wafer plane has terminal pads on a terminal-pad side perpendicular to the upper side, each terminal pad being conductively connected to an assigned contact surface. This allows vertical mounting of the chip on a substrate and contacting with the aid of customary bonding techniques. A manufacturing method and two mounting methods are described.

Abstract: A microelectromechanical system microphone package has at least one sensitive diaphragm provided in the front side of a microphone component. The microphone component and a cap wafer are connected to one another with their front sides facing one another. The cap wafer functions as an intermediate wafer for installing the microelectromechanical system microphone package. The cap wafer is provided with feedthroughs so that the microphone component is electrically contactable via the cap wafer.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.