Abstract: Method for forming a clean environment for semiconductor substrates with low humidity level including the steps of measuring a humidity level in the environment using a humidity sensor to keep the environment within a predetermined interval around a humidity set point or at a humidity set point and providing a gas to the environment, until the humidity level reduces to a value within the predetermined interval around the set point or to the set point.

Abstract: The invention relates to an inspection system adapted for determining a state and/or content of a wafer or reticle container or at least a part of a wafer or reticle container, comprising a detection device or a multitude of detection devices (102, 104, 152, 154, 156, 158, 160, 164) adapted to receive detection data from a surface and/or interior of the wafer or reticle container or the part of a wafer or reticle container indicative of the state and/or content of the wafer or reticle container or the part of a wafer or reticle container.

Abstract: The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.

Abstract: A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

Abstract: The invention relates to a method for cleaning a synthetic surface, in particular to remove metal dirt and/or particles therefrom, said method being characterized by the following steps: a) the synthetic surface is rinsed with deionized water; b) the synthetic surface is rinsed with electrolyzed water; and c) the synthetic surface is rinsed with deionized water.

Abstract: Method for inspection of an inner pod EIP and/or an outer pod EOP of an EUV pod, respectively including a base member and a cover member. The method includes acquiring inspection data sets using a line scan camera and an area scan camera, inspecting the cover member in a first inspection unit using the line scan camera, inspecting the base member in a second inspection unit using the area scan camera, inspecting the cover member in the second inspection unit using the area scan camera, and inspecting the base member in the first inspection unit using the line scan camera.

Abstract: A one-piece clamping device, a storage system and an operating method for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A further aspect provides a stocker for storing EUV reticles.

Abstract: A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

Abstract: Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

Abstract: Methods and apparatuses for integrated cleaning of objects comprising a sequence of wet cleaning and vacuum drying in a same process chamber. The present integrated cleaning process can eliminate moving parts, improving the system reliability. Vacuum decontamination can be included for degassing and decontaminating the cleaned objects. In an embodiment, a cleaner system combines various movements into an integrated movement to be handled by a robot, for example, to improve the throughput. For example, an integrated robot movement comprising picking up a closed container from the input load port, moving both the lid and body together, and then depositing the body and lid separately into the appropriate positions in the cleaner to be cleaned.

Abstract: In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.

Abstract: The present invention relates to apparatuses and methods to store and transfer objects, and more particularly to workpiece stocker configurations such as stacker for semiconductor wafers, reticles or carrier boxes.

Abstract: The invention relates to an apparatus (200, 200A, 300, 400) for a semiconductor production facility handling an object, the apparatus comprising a core module (100) and at least one functionality module (M . . . ). A core module (100) as well as an operating method for such an apparatus are further aspects of the invention.

Abstract: A clamping device, a storage system and an operating method for an EUV reticle stocker are provided. The required space for storing EUV reticles is significantly reduced while ensuring a high quality storage environment for the stored EUV reticles. A stocker for storing EUV reticles is also provided.

Abstract: A buffer station for automatic material handling system can provide throughput improvement. Further, by storing to-be-accessed workpieces in the buffer stations of an equipment, the operation of the facility is not interrupted when the equipment is down. The buffer station can be incorporated in a stocker, such as bare wafer stocker.

Abstract: Methods and apparatuses for integrated cleaning of objects comprising a sequence of wet cleaning and vacuum drying in a same process chamber. The present integrated cleaning process can eliminate moving parts, improving the system reliability. Vacuum decontamination can be included for degassing and decontaminating the cleaned objects. In an embodiment, a cleaner system combines various movements into an integrated movement to be handled by a robot, for example, to improve the throughput. For example, an integrated robot movement comprising picking up a closed container from the input load port, moving both the lid and body together, and then depositing the body and lid separately into the appropriate positions in the cleaner to be cleaned.

Abstract: The present invention relates to apparatuses and methods to store and transfer objects, and more particularly to workpiece stocker configurations such as stacker for semiconductor wafers, reticles or carrier boxes.

Abstract: A reticle compartment defining an enclosed interior adapted to store at least two reticles in a resticle storage portion, including an inlet port, through which a purge gas can enter the enclosed enterior, and an outlet port, through which the purge gas can exit the enclosed interior, wherein the reticle compartment further includes a first diffusor plate arranged in the enclosed interior between the inlet port and the reticle storage portion, wherein the first diffusor plate is provided with openings, through which the purge gas can flow, the openings in a central section of the first diffusor plate being provided with a larger individual opening area and/or providing a large total opening area per unit area than openings in a peripheral section of the first diffusor plate.

Abstract: Provided are methods and systems for cleaning various semiconductor substrate storage articles, in particular, FOUP doors. The FOUP doors and other similar articles often have openings that may get contaminated with cleaning liquids if not covered. The described cleaning system includes contact points for engaging the article and covering these openings. The contact points may be also used for supporting the article and for pressurizing the openings in the article with a gas. The gas may be supplied through one or more contact points. It prevents liquids from getting into the openings if even the openings are not completely sealed. The pressurization may be maintained through the entire wet portion of the cleaning process. The article may be rotated within the cleaning system while cleaning and/or other liquids or gases are dispensed through a set of spraying nozzles. Spraying nozzles may move to enhance cleaning of the article.

Abstract: An EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.