Patents by Inventor Lutz Stamp

Lutz Stamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10975474
    Abstract: A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: April 13, 2021
    Assignee: Atotech Deutschland GmbH
    Inventors: Christian Wendeln, Lutz Stamp, Bexy Dosse, Kay Wurdinger, Gerson Krilles, Tang Cam Lai Nguyen
  • Publication number: 20190169751
    Abstract: A process for depositing metal or metal alloy on a substrate including treating the substrate surface with an activation solution comprising a source of metal ions so the metal ions are adsorbed on the substrate surface, treating the obtained substrate surface with a treatment solution containing an additive selected from thiols, thioethers, disulphides and sulphur containing heterocycles, and a reducing agent suitable to reduce the metal ions adsorbed on the substrate surface selected from boron based reducing agents, hypophosphite ions, hydrazine and hydrazine derivatives, ascorbic acid, iso-ascorbic acid, sources of formaldehyde, glyoxylic acid, sources of glyoxylic acid, glycolic acid, formic acid, sugars, and salts of aforementioned acids; and subsequently treating the substrate surface with a metallizing solution comprising a source of metal ions to be deposited such that a metal or metal alloy is deposited thereon.
    Type: Application
    Filed: May 4, 2017
    Publication date: June 6, 2019
    Inventors: Christian WENDELN, Lutz STAMP, Bexy DOSSE, Kay WURDINGER, Gerson KRILLES, Tang Cam Lai NGUYEN
  • Patent number: 9920432
    Abstract: A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: March 20, 2018
    Assignee: Atotech Deutschland GmbH
    Inventors: Thomas Thomas, Lutz Brandt, Lutz Stamp, Hans-Jürgen Schreier
  • Publication number: 20160205783
    Abstract: The present invention relates to a method for treatment of recessed structures in a dielectric material for smear removal during the manufacture of printed circuit boards, IC substrates and the like. The dielectric material is contacted with an aqueous solution comprising 60 to 80 wt.-% sulfuric acid and 0.04 to 0.66 mol/l peroxodisulfate ions peroxodisulfate ions and at least one stabilizing additive selected from alcohols, molecular ethers and polymeric ethers. Smear is removed from the recessed structures by the method according to the present invention without penetration of process chemicals into the dielectric material and a sufficiently low copper etching rate is achieved. Furthermore, the shelf life of said aqueous solution is improved even in the presence of copper ions.
    Type: Application
    Filed: September 5, 2014
    Publication date: July 14, 2016
    Inventors: Edith Steinhäuser, Stefanie Wiese, Laurence John Gregoriades, Julia Schiemann, Lutz Stamp
  • Publication number: 20140370313
    Abstract: A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.
    Type: Application
    Filed: December 5, 2012
    Publication date: December 18, 2014
    Inventors: Thomas Thomas, Lutz Brandt, Lutz Stamp, Hans-Jürgen Schreier
  • Publication number: 20140242264
    Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
    Type: Application
    Filed: October 1, 2012
    Publication date: August 28, 2014
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Edith Stenhäuser, Sandra Röseler, Stefanie Wiese, Tang Cam Lai Nguyen, Lutz Stamp
  • Patent number: 8137575
    Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.
    Type: Grant
    Filed: October 19, 2005
    Date of Patent: March 20, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Merten Piel, Brigitte Steder, legal representative, Rolf Piel, legal representative, Elke Piel, legal representative, Lutz Stamp, Christiane Moepert
  • Publication number: 20090200263
    Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.
    Type: Application
    Filed: October 19, 2005
    Publication date: August 13, 2009
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Merten Piel, Brigitte Steder, Rolf Piel, Elke Piel, Lutz Stamp, Christiane Moepert
  • Patent number: 7025867
    Abstract: The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: April 11, 2006
    Assignee: Atotech Deutschland GmbH
    Inventors: Regina Czeczka, Lutz Stamp
  • Publication number: 20040112755
    Abstract: The invention relates to a method for the direct electrolytic metallization of electrically non-conducting substrate surfaces comprising bringing the substrate surfaces into contact with a water-soluble polymer; treating the substrate surfaces with a permanganate solution; treating the substrate surfaces with an acidic aqueous solution or an acidic microemulsion of aqueous base containing at least one thiophene compound and at least one alkane sulfonic acid selected from the group comprising methane sulfonic acid, ethane sulfonic acid and ethane disulfonic acid; electrolytically metallizing the substrate surfaces.
    Type: Application
    Filed: September 17, 2003
    Publication date: June 17, 2004
    Inventors: Regina Czeczka, Lutz Stamp
  • Patent number: 6325910
    Abstract: The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilizing the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metallize the substrate surfaces directly and electrolytically. By means of this method, the nonconductive areas of the holes in printed circuit boards can be directly electrolytically metallized.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: December 4, 2001
    Assignee: Atotch Deutschland GmbH
    Inventors: Heinrich Meyer, Lutz Stamp
  • Patent number: 5503877
    Abstract: Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N or O atom, or a multiple bond, or several of these elements. The complex compounds are useful for the generation of metal seeds on a non-metallic substrate.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: April 2, 1996
    Assignee: Atotech Deutschalnd GmbH
    Inventors: Lutz Stamp, Elisabeth Zettelmeyer, Heinrich Meyer, Gonzalo U. Desmaison
  • Patent number: 5421989
    Abstract: A process for applying a principal metal coating to a non-conductive substrate without employing an electroless coating is disclosed comprising:(a) contacting the substrate with a suspension comprising a noble metal colloid suspended in a polymer matrix to obtain a coated substrate;(b) optionally removing at least part or substantially all of the polymer matrix from said coated substrate;(c) electrolytically coating the substrate obtained after step (a) or (b) with a solution of the principal metal coating. The polymer matrix is selected to combine with the metal of the noble metal coating or principal metal or both. Prior to contacting the substrate with the suspension, it may be contacted with a conditioner that will combine with the noble metal or principal metal or both to obtain a conditioned substrate. The conditioned substrate is then contacted with the suspension.
    Type: Grant
    Filed: September 3, 1993
    Date of Patent: June 6, 1995
    Assignee: Atotech Deutschland GmbH
    Inventors: Lutz Stamp, Elisabeth Zettelmeyer-Decker, Norbert Tiemann