Abstract: By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.

Abstract: A wafer cleaning apparatus includes a wafer supporting device for supporting a wafer to be cleaned, and sponges for cleaning the wafer. The sponges are arranged in contact with either surface of the wafer and are rotated along rotational axes that are parallel to the wafer. A sponge positioning device pushes the sponges against the wafer. A wafer rotation drive is adapted to rotate the wafer at a constant speed, and a sponge rotation drive system is adapted to rotate the sponges at a constant speed. A closed loop controller receives motor current signals from the wafer rotation drive and/or the sponge rotation drive system, and the closed loop controller provides an adjustment signal to the sponge positioning device. The adjustment signal is for adjusting the friction between the sponges and the wafer.

Abstract: A polishing head (200) for a chemical-mechanical polishing machine that holds a semiconductor wafer (150) against a polishing pad (140) has a chuck (295) with a pressure chamber (210) to apply a down force substantially equally to the wafer backside (152). An electrode arrangement (270) within the chamber (210) is located coplanar to the wafer (150) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities.