Abstract: A method of fabricating individual, embedded capacitors in multilayer printed circuit boards is disclosed. The method is compatible with standard printed circuit board fabrication. The capacitor fabrication is based on a sequential build-up technology employing a first patternable insulator. After patterning of the insulator, pattern grooves are filled with a high dielectric constant material, typically a polymer/ceramic composite. Capacitance values are defined by the pattern size, thickness and dielectric constant of the composite. Capacitor electrodes and other electrical circuitry can be created either by etching laminated copper, by metal evaporation or by depositing conductive ink.