Abstract: The invention relates generally to polypeptides that include at least a first cleavable moiety (CM1) that is a substrate for at least one matrix metalloprotease (MMP) and at least a second cleavable moiety (CM2) that is a substrate for at least one serine protease (SP), to activatable antibodies and other larger molecules that include these polypeptides that include at least a CM1 that is a substrate for at least one MMP protease and at least a CM2 that is a substrate for at least one SP protease, and to methods of making and using these polypeptides that include at least a CM1 that is a substrate for at least one MMP protease and at least a CM2 that is a substrate for at least one SP protease in a variety of therapeutic, diagnostic and prophylactic indications.

Abstract: The invention relates generally to polypeptides that include a cleavable moiety that is a substrate for at least one protease selected from matriptase and u-plasminogen activator (uPA), to activatable antibodies and other larger molecules that include the cleavable moiety that is a substrate for at least one protease selected from matriptase and u-plasminogen activator, and to methods of making and using these polypeptides that include a cleavable moiety that is a substrate for at least one protease selected from matriptase and u-plasminogen activator in a variety of therapeutic, diagnostic and prophylactic indications.

Abstract: The invention relates generally to polypeptides that include a cleavable moiety that is a substrate for at least one matrix metalloprotease (MMP), to activatable antibodies and other larger molecules that include the cleavable moiety that is a substrate for at least one MMP protease, and to methods of making and using these polypeptides that include a cleavable moiety that is a substrate for at least one MMP protease in a variety of therapeutic, diagnostic and prophylactic indications.

Abstract: The invention relates generally to activatable antibodies that include a masking moiety (MM), a cleavable moiety (CM), and an antibody (AB) that specifically binds to interleukin-6 receptor (IL-6R), and to methods of making and using these anti-IL-6R activatable antibodies in a variety of therapeutic, diagnostic and prophylactic indications.

Abstract: A bonded semiconductor structure is formed in a method that first forms a female semiconductor structure with pyramid-shaped openings and a male semiconductor structure with pyramid-shaped projections, and then inserts the projections into the openings to align the male semiconductor structure to the female semiconductor structure for bonding.

Abstract: Optoelectronic packages and wafer level techniques for forming optoelectronic packages are described. In accordance with one apparatus aspect of the invention, a pair of substrates are bonded together to form an optical coupler. A first one of the substrates has a recess that faces the second substrate to at least in part define a channel suitable for receiving an optical transmission medium. A photonic device is mounted on a mounting surface of the second substrate that is opposite its bonded surface. The photonic device faces the reflective surface and an optical path is formed between the channel and the photonic element that both reflects off of the reflective surface and passes through the second substrate. In some embodiments an integrated circuit device and/or solder bumps are also attached to the mounting surface and the second substrate has conductive traces thereon that electrically couple the various electrical components as appropriate (e.g.

Abstract: Optoelectronic packages and wafer level techniques for forming optoelectronic packages are described. In accordance with one apparatus aspect of the invention, a pair of substrates are bonded together to form an optical coupler. A first one of the substrates has a recess that faces the second substrate to at least in part define a channel suitable for receiving an optical transmission medium. A photonic device is mounted on a mounting surface of the second substrate that is opposite its bonded surface. The photonic device faces the reflective surface and an optical path is formed between the channel and the photonic element that both reflects off of the reflective surface and passes through the second substrate. In some embodiments an integrated circuit device and/or solder bumps are also attached to the mounting surface and the second substrate has conductive traces thereon that electrically couple the various electrical components as appropriate (e.g.

Abstract: A hardware health evaluation module is associated with a hardware module or device and employs a linked list of error records to continually evaluate the state of the hardware module to determine whether or not it is currently operating with or without errors. In the event that the health evaluation module determines that the hardware module is not operating in an error free manner, it detects and stores, for a specified period of time, an indication of the error and associates this detected error or errors with one or more of the error records. The error records are designed to provide assistance in diagnosing the cause of a hardware error.

Abstract: An embodiment of the invention is an illuminator. A handle has first and second ends. A first light source is attached to the handle the first end. The first light source is powered by an external power source via a wire running through or along the handle. Another embodiment includes a bite block, a holder embedded in the bite block, and a light source attached to the holder to illuminate an operation field. The light source is powered by a power source. Another embodiment includes an absorbent pad and an illuminator having a light source attached to the absorbent pad to generate light when powered by a power source. Another embodiment includes first and second biting pads and a pillar between the first and second biting pads having a length adjusted according to distance between upper and lower teeth.

Abstract: A multi-functional dental instrument has a base handle and a first attachment. The base handle has first and second base ends opposite to each other. The base handle comprises a power connector to connect to a power source and a first base connector at the first base end. The first attachment is coupled to the first base connector at the first base end. The first attachment is powered by the power source to perform a first dental task at a working area. Another embodiment includes a bite block, a holder embedded in the bite block, and a light source attached to the holder to illuminate an operation field. The light source is powered by a power source. Another embodiment includes an absorbent pad and an illuminator having a light source attached to the absorbent pad to generate light when powered by a power source.

Abstract: A service element is defined and represented by a data structure. It includes one or more components and/or one or more other service elements. A service element providing a complete function is a service offering. Management of service elements and/or service offerings is facilitated by a Service Development Tool. In different aspects, the management includes various tasks associated with creating, modifying and deleting service elements, establishing relationships, error checking and optimization. In a further aspect, service elements are packaged and distributed to enable customers to deliver the service elements. Additionally, the hosting of software packages is facilitated.

Abstract: A mechanism provides a model-driven solution template-based approach for managed business services. Key assets of the business services are templatized and made configurable. The mechanism implements a metamodel describing standard service offerings that can be configured to meet specific business and operational requirements at a level of business process and system components. A cost and pricing model of service offerings helps assess the service costs and resource requirements based on a client's selection of standard and customized processes and system components. A supporting system solution is developed based upon underlying solution templates and solution artifacts as well as client-specific requirements.

Abstract: Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the envirorunent and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

Abstract: A method and system is presented for bypassing a local Domain Name Server (DNS) when using edge caching servers. Domain names of frequently used business applications that are known to rely upon edge servers, together with the corresponding authoritative DNSs, are listed in both local hosts file and user defined FSFD local configuration file fsfd.conf. When the client computer's browser attempts to resolve a domain name, a File System Filtering Driver (FSFD) in the client computer intercepts the browser's request. If the domain name which is being resolved is found in a local FSFD configuration file fsfd.conf, then the FSFD initiates a DNS request directly to the appropriate authoritative DNS whose IP address gets extracted from the fsfd.conf record, thus bypassing the local DNS. The authoritative DNS returns the IP address for an edge caching server that is topographically proximate to the client computer's browser.

Abstract: The invention discloses an electrical interconnect with minimal parasitic capacitance. In one embodiment, an apparatus comprises a semiconductor substrate, and first and second support structures formed on the substrate, where the second support structure at least partially surrounds the first support structure on the substrate. The first and second support structures are each configured to support an electrical connector to be formed over the first and second support structures on the substrate.

Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.

Abstract: A client application server includes a client server, a proxy authentication server, and an authentication server. The proxy authentication server maintains a set of one or more authentication rules and an authentication request table. The client server is responsive to an authentication request from a user including a user identifier for directing the authentication request to the proxy authentication server for searching the authentication request table for entries for the client; responsive to finding one or more entries, applying the filter rules; responsive failing a filter rule, rejecting the authentication request in a response message to the client server; and responsive to passing all relevant filter rules, directing the authentication request to the authentication server for authenticating the user.

Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.

Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

Abstract: A method, system, and computer program product for processing a database query by a proxy server that is adapted to communicate with at least one database server. The database servers are respectively coupled to corresponding databases having tables that include a data isolation field pertaining to a group having subgroups. The data isolation field identifies a subgroup. The proxy server receives the query from an application server. The query is a request for data stored one of the databases. The proxy server determines whether the query has a data isolation problem. If the query does not have a data isolation problem, then the proxy server obtains a response to the query from one of the database servers and forwards the response to the application server. Otherwise, the proxy server records that a query error has occurred and returns an error code and/or empty dataset to the application server.