Patents by Inventor Luu T. Nguyen

Luu T. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5422435
    Abstract: A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.
    Type: Grant
    Filed: May 22, 1992
    Date of Patent: June 6, 1995
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Peng-Cheng Lin, Luu T. Nguyen
  • Patent number: 5328079
    Abstract: Certain components of an integrated circuit package are disclosed herein including one or more dies, each of which has an array of die output/input bond pads, and die support means, for example a substrate or leadframe, which includes an array of electrically conductive leads. There is also disclosed herein a technique for wire bond connecting the bond pads of a particular die to either the bond pads of a second die or to the electrically conductive leads of the substrate or leadframe using a thermosonic or thermocompression ball bonding tool. In accordance with this technique, where at least one die is involved, connections are made to the bond pads of that die by means of stitch bonding in a way which does not damage the die.
    Type: Grant
    Filed: March 19, 1993
    Date of Patent: July 12, 1994
    Assignee: National Semiconductor Corporation
    Inventors: Ranjan J. Mathew, Arnold Smith, Luu T. Nguyen
  • Patent number: 5296743
    Abstract: A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the package's formation. The package itself includes an IC chip having an array of chip output/input terminals, and means for supporting the chip including an array of electrically conductive leads, all of which are provided for connection with the output/input terminals of the IC chip. In addition, the overall package includes bonding wires connecting the chip output/input terminals with respective ones of the leads such that each bonding wire extends in a direction that defines an acute angle of less than 45 degrees with the given flow direction of the plastic material used to encapsulate the IC chip, support means and bonding wires. In a preferred embodiment, at least a portion and most preferably substantially all of the bonding wires are substantially parallel with the given flow direction of the plastic material.
    Type: Grant
    Filed: May 7, 1993
    Date of Patent: March 22, 1994
    Assignee: National Semiconductor Corporation
    Inventors: Luu T. Nguyen, Hem P. Takiar
  • Patent number: 5130781
    Abstract: A method and apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
    Type: Grant
    Filed: October 1, 1990
    Date of Patent: July 14, 1992
    Assignee: IBM Corporation
    Inventors: Caroline A. Kovac, Peter G. Ledermann, Luu T. Nguyen
  • Patent number: 5049201
    Abstract: Disclosed is a method of inhibiting corrosion on an electronic component. The method includes the steps of obtaining an electronic component and then cleaning the electronic component in a solution consisting of a complexing agent and a solvent in which the complexing agent is soluble. The complexing agent is a crown compound.
    Type: Grant
    Filed: June 22, 1989
    Date of Patent: September 17, 1991
    Assignee: International Business Machines Corporation
    Inventors: Shirley Cheng, Constance J. Araps, Allen J. Arnold, Jeffrey T. Coffin, Luu T. Nguyen
  • Patent number: 4934309
    Abstract: A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an ominidirectional tool for deposition.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: June 19, 1990
    Assignee: International Business Machines Corporation
    Inventors: Peter G. Ledermann, Luu T. Nguyen
  • Patent number: 4881885
    Abstract: An apparatus to encapsulate a device and joints coupled to conductive leads with an encapsulating material. A fixture has a recess to hold via a vacuum the device in place. Conduits in the fixture supply air around the device to form an air dam that flows outward around the device and the leads. A nozzle supplies a metered amount of material to the surface of the device. By controlling the temperature of the fixture and/or the air forming the air dam, the flow of material can be confined to the surface of the device and the joints as it cures. The method can also provide encapsulant edge capping to reduce device stresses.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: November 21, 1989
    Assignee: International Business Machines Corporation
    Inventors: Caroline A. Kovac, Peter G. Ledermann, Luu T. Nguyen