Patents by Inventor Luz Karine SANDOVAL GRANADOS

Luz Karine SANDOVAL GRANADOS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
    Publication number: 20220196507
    Abstract: An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Inventors: Prabhakar SUBRAHMANYAM, Yi XIA, Ying-Feng PANG, Victor POLYANKO, Mark BIANCO, Bijoyraj SAHU, Minh T.D. LE, Carlos ALVIZO FLORES, Javier AVALOS GARCIA, Adriana LOPEZ INIGUEZ, Luz Karine SANDOVAL GRANADOS, Michael BERKTOLD, Damion SEARLS, Jin YANG, David SHIA, Samer MELHEM, Jeffrey Ryan CONNER, Hemant DESAI, John RAATZ, Richard DISCHLER, Bergen ANDERSON, Eric W. BUDDRIUS, Kenan ARIK, Barrett M. FANEUF, Lianchang DU, Yuehong FAN, Shengzhen ZHANG, Yuyang XIA, Jun ZHANG, Yuan Li, Catharina BIBER, Kristin L. WELDON, Brendan T. PAVELEK
  • Liquid cooling system with sub atmospheric pressure coolant
    Patent number: 10939592
    Abstract: A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Javier Avalos Garcia, Michael Berktold, Luz Karine Sandoval Granados, Adriana Lopez Iniguez
  • LIQUID COOLING SYSTEM WITH SUB ATMOSPHERIC PRESSURE COOLANT
    Publication number: 20190297754
    Abstract: A liquid cooling system is described. The liquid cooling system includes a heat sink to provide a warmed liquid. The heat sink is to receive heat generated by at least one semiconductor chip of an electronic system. The liquid cooling system includes a heat exchanger to receive the warmed liquid and to provide a cooled liquid. The liquid cooling system includes a pump. The pump is to draw the cooled liquid at the pump's input so that respective pressures of the warmed and cooled liquids' are less than atmospheric pressure.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 26, 2019
    Inventors: Javier AVALOS GARCIA, Michael BERKTOLD, Luz Karine SANDOVAL GRANADOS, Adriana LOPEZ INIGUEZ