Abstract: A physical structure and a method for forming a electronic devices on a substrate comprising: providing a substrate; forming a plurality of layers on the substrate, the layers comprising at least two layers of conducting material and a layer of insulating material therebetween; depositing photoresist material onto predetermined regions of the plurality of layers, the photoresist material varying in thickness; utilizing gray scale illumination on the photoresist material; removing a portion of the layers using physical etching to expose predetermined portions of the conducting layers. Optionally, the photoresist may be utilized on a plurality of discrete electronic devices concurrently, such that the gray scale illumination is conducted on a plurality of discrete electronic devices concurrently. Similarly, the physical etching may be conducted on the discrete electronic devices concurrently; removing different thicknesses of material concurrently. Also claimed is a product made by the claimed method.

Abstract: A physical structure and a method for forming a electronic devices on a substrate comprising: providing a substrate; forming a plurality of layers on the substrate, the layers comprising at least two layers of conducting material and a layer of insulating material therebetween; depositing photoresist material onto predetermined regions of the plurality of layers, the photoresist material varying in thickness; utilizing gray scale illumination on the photoresist material; removing a portion of the layers using physical etching to expose predetermined portions of the conducting layers. Optionally, the photoresist may be utilized on a plurality of discrete electronic devices concurrently, such that the gray scale illumination is conducted on a plurality of discrete electronic devices concurrently. Similarly, the physical etching may be conducted on the discrete electronic devices concurrently; removing different thicknesses of material concurrently. Also claimed is a product made by the claimed method.

Abstract: The invention relates to a process for microencapsulation of phase change materials based on free radicals polymerization comprising: a) the preparation of i) a solution with, at least, a hydrophilic liquid and a stabilizer (continuous phase) and ii) a solution with, at least, a phase change material, a free radical initiator and a polymerizable material (discontinuous phase); b) the preparation of an emulsion by dispersing the discontinuous phase in the continuous phase under vigorous stirring; and c) the polymerization of monomers until the phase change material becomes microencapsulated. This process is simple and effective and avoids the use of hazardous compounds. The invention also relates to microcapsules obtainable by said process and to the use thereof in the thermal protection and storage of heat.