Abstract: A storage node configuration method includes obtaining service requirement information, where the service requirement information includes a burst access moment, a burst access bandwidth, or burst access duration of a computing node for a storage node; determining target configuration information based on the service requirement information, where the target configuration information is used to configure a peak bandwidth and peak bandwidth duration that are of the storage node; and sending the target configuration information to the storage node.

Abstract: This application provides a computing device based on a phase-change liquid cooling technology, including a body, a jet component, and a power component. Space in the body is divided into a first accommodation cavity and a second accommodation cavity through a partition plate. The first accommodation cavity is configured to accommodate a first coolant, the second accommodation cavity is configured to accommodate a heating element and a second coolant, and a temperature of the second coolant is higher than a temperature of the first coolant. The body is provided with a liquid refill opening communicating with the first accommodation cavity and an exhaust vent communicating with the second accommodation cavity. The power component is connected to the jet component, and is configured to pump the first coolant to the heating element through the jet component.

Abstract: A method for adjusting a specification parameter of a solid-state drive (SSD) includes that the SSD receives a configuration command through an internal configuration interface, where a current specification parameter of the SSD is a first specification parameter, and the configuration command includes representation information of a second specification parameter; and then the SSD adjusts the specification parameter of the SSD from the first specification parameter to the second specification parameter based on the configuration command.

Abstract: A storage node configuration method includes obtaining service requirement information, where the service requirement information includes a burst access moment, a burst access bandwidth, or burst access duration of a computing node for a storage node; determining target configuration information based on the service requirement information, where the target configuration information is used to configure a peak bandwidth and peak bandwidth duration that are of the storage node; and sending the target configuration information to the storage node.

Abstract: A chip module has a plurality of first ports, at least some or all of the first ports are first selection ports, and each first selection port may act as a write port or a read port. The chip module further includes a first control module. The first control module controls, based on a transmit/receive requirement of the chip module, the first selection port to be switched to a read port or a write port, to match the transmit/receive requirement of the chip module. The first selection port may selectively act as a read port or a write port, so that switching can be performed based on an operating state of the chip module, increasing a read/write bandwidth. The first control module controls an operating state of the first selection port, to flexibly adjust a quantity of read ports and a quantity of write ports of the chip module.

Abstract: A chip module has a plurality of first ports, at least some or all of the first ports are first selection ports, and each first selection port may act as a write port or a read port. The chip module further includes a first control module. The first control module controls, based on a transmit/receive requirement of the chip module, the first selection port to be switched to a read port or a write port, to match the transmit/receive requirement of the chip module. The first selection port may selectively act as a read port or a write port, so that switching can be performed based on an operating state of the chip module, increasing a read/write bandwidth. The first control module controls an operating state of the first selection port, to flexibly adjust a quantity of read ports and a quantity of write ports of the chip module.

Abstract: A chip module has a plurality of first ports, at least some or all of the first ports are first selection ports, and each first selection port may act as a write port or a read port. The chip module further includes a first control module. The first control module controls, based on a transmit/receive requirement of the chip module, the first selection port to be switched to a read port or a write port, to match the transmit/receive requirement of the chip module. The first selection port may selectively act as a read port or a write port, so that switching can be performed based on an operating state of the chip module, increasing a read/write bandwidth. The first control module controls an operating state of the first selection port, to flexibly adjust a quantity of read ports and a quantity of write ports of the chip module.

Abstract: A chassis of a server comprises a backplane. The backplane is disposed in the chassis of the server, and the backplane includes a first sub-board, a second sub-board, and at least one air baffle. The first sub-board is isolated from the second sub-board. Each air baffle forms an included angle with the first sub-board and forms an included angle with the second sub-board. Space enclosed by the first sub-board, the second sub-board, and a side wall, an upper wall, and a lower wall of the chassis is divided into a first air cavity and at least one second air cavity by using the at least one air baffle. The first air cavity is used for at least one first module to dissipate heat, and the second air cavity is used for at least one second module to dissipate heat.

Abstract: A chassis of a server comprises a backplane. The backplane is disposed in the chassis of the server, and the backplane includes a first sub-board, a second sub-board, and at least one air baffle. The first sub-board is isolated from the second sub-board. Each air baffle forms an included angle with the first sub-board and forms an included angle with the second sub-board. Space enclosed by the first sub-board, the second sub-board, and a side wall, an upper wall, and a lower wall of the chassis is divided into a first air cavity and at least one second air cavity by using the at least one air baffle. The first air cavity is used for at least one first module to dissipate heat, and the second air cavity is used for at least one second module to dissipate heat.

Abstract: A reciprocating power tool includes a reciprocating cutting mechanism arranged to be driven by a motor via a driving assembly. The driving assembly includes a resilient arrangement arranged to be charged when the cutting mechanism is driven by the motor. When the drive from the motor is terminated, the resilient arrangement is arranged to reverse the cutting mechanism from the direction of the drive from the motor.

Abstract: A reciprocating power tool includes a reciprocating cutting mechanism arranged to be driven by a motor via a driving assembly. The driving assembly includes a resilient arrangement arranged to be charged when the cutting mechanism is driven by the motor. When the drive from the motor is terminated, the resilient arrangement is arranged to reverse the cutting mechanism from the direction of the drive from the motor.