Patents by Inventor Lvfeng YANG

Lvfeng YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hot-forging die with conformal meshy structured cavity surface layer and preparation method thereof
    Patent number: 11465195
    Abstract: The present disclosure discloses a hot-forging die with the conformal meshy structured cavity surface layer and a preparation method thereof. A large-scale hot-forging die includes a die substrate, and a sandwiched layer, a transition layer and a reinforcement layer are formed on the die substrate in sequence. The reinforcement layer and the transition layer are separated into a plurality of small units by the grooves. All the grooves are interconnected and communicated to form a meshy structure. The transition layer grooves are filled with ordinary soft material; the reinforcement layer grooves are filled with high temperature resistant soft material.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: October 11, 2022
    Assignees: CHONGQING JIEPIN TECHNOLOGY CO., LTD, CHONGQING UNIVERSITY
    Inventors: Jiansheng Zhang, Jie Zhou, Yuping Gan, Qian Zhang, Qiuyun Wang, Lvfeng Yang
  • HOT-FORGING DIE WITH CONFORMAL MESHY STRUCTURED CAVITY SURFACE LAYER AND PREPARATION METHOD THEREOF
    Publication number: 20220134411
    Abstract: The present disclosure discloses a hot-forging die with the conformal meshy structured cavity surface layer and a preparation method thereof. A large-scale hot-forging die includes a die substrate, and a sandwiched layer, a transition layer and a reinforcement layer are formed on the die substrate in sequence. The reinforcement layer and the transition layer are separated into a plurality of small units by the grooves. All the grooves are interconnected and communicated to form a meshy structure. The transition layer grooves are filled with ordinary soft material; the reinforcement layer grooves are filled with high temperature resistant soft material.
    Type: Application
    Filed: June 13, 2019
    Publication date: May 5, 2022
    Inventors: Jiansheng ZHANG, Jie ZHOU, Yuping GAN, Qian ZHANG, Qiuyun WANG, Lvfeng YANG