Patents by Inventor Lweness Mazari

Lweness Mazari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Additive manufactured 3D electronic substrate
    Patent number: 11765839
    Abstract: A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 19, 2023
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Steven O. Dunford, Mark Kostinovsky, Lweness Mazari
  • Solder joints on nickel surface finishes without gold plating
    Patent number: 11676926
    Abstract: A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: June 13, 2023
    Assignee: Schlumberger Technology Corporation
    Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
  • Interconnection of copper surfaces using copper sintering material
    Patent number: 11329023
    Abstract: A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: May 10, 2022
    Assignee: Schlumberger Technology Corporation
    Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
  • SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
    Publication number: 20220059489
    Abstract: A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.
    Type: Application
    Filed: August 24, 2020
    Publication date: February 24, 2022
    Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
  • INTERCONNECTION OF COPPER SURFACES USING COPPER SINTERING MATERIAL
    Publication number: 20210320082
    Abstract: A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.
    Type: Application
    Filed: August 24, 2020
    Publication date: October 14, 2021
    Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
  • ADDITIVE MANUFACTURED 3D ELECTRONIC SUBSTRATE
    Publication number: 20200120813
    Abstract: A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 16, 2020
    Inventors: Steven O. Dunford, Mark Kostinovsky, Suriyakan Kleitz, Man To, Lweness Mazari