Patents by Inventor Ly Tat PEH

Ly Tat PEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230343741
    Abstract: A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.
    Type: Application
    Filed: April 25, 2022
    Publication date: October 26, 2023
    Inventors: Hing Leung LI, Hoi Ting LAM, Tsz Kit YU, Ly Tat PEH
  • Patent number: 11798911
    Abstract: A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 24, 2023
    Assignee: ASMPT SINGAPORE PTE. LTD.
    Inventors: Hing Leung Li, Hoi Ting Lam, Tsz Kit Yu, Ly Tat Peh