Abstract: Nozzles for an additive manufacturing device and methods for improving wettability of the nozzles are disclosed. The method may include subjecting the nozzle to a surface treatment. The surface treatment may include contacting a surface of the nozzle with one or more surface modifying agents. The surface modifying agents may include one or more of an oxidizing agent, an acid, a base, or combinations thereof. The one or more surface modifying agents may increase an oxygen content of the surface of the nozzle. An inner surface of the nozzle may have a water contact angle of greater than 1° and less than about 90°. The inner surface of the nozzle may be free or substantially free of a coating.

Abstract: Nozzles for additive manufacturing and methods for improving wettability of the nozzles are disclosed. The nozzle may include a body having an inner surface and an outer surface. The inner surface may define an inner volume of the nozzle, and may have a water contact angle of greater than 1° and less than about 90°. The method may include subjecting the nozzle to a surface treatment. The surface treatment may include plasma treating a surface of the nozzle such that free radicals, polar functional groups, or a combination thereof are formed at the surface of the nozzle.

Abstract: Nozzles for an additive manufacturing device and methods for improving wettability of the nozzles are disclosed. The method may include subjecting the nozzle to a surface treatment. The surface treatment may include contacting a surface of the nozzle with one or more surface modifying agents. The surface modifying agents may include one or more of an oxidizing agent, an acid, a base, or combinations thereof. The one or more surface modifying agents may increase an oxygen content of the surface of the nozzle. An inner surface of the nozzle may have a water contact angle of greater than 1° and less than about 90°. The inner surface of the nozzle may be free or substantially free of a coating.

Abstract: An ink jet printhead including a substrate such as an ink reservoir or an interposer and a printing device. The printing device can be attached to the substrate with a first adhesive and with a second adhesive that is different than the first adhesive. The second adhesive can be applied to the printing device and to the substrate after attaching the printing device to the substrate with the first adhesive. The second adhesive can seal a gap from an ink channel in the substrate to a location between the printing device and the substrate.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.

Abstract: A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.