Patents by Inventor Lyne Dore
Lyne Dore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10368461Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: GrantFiled: September 20, 2018Date of Patent: July 30, 2019Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
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Publication number: 20190029139Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: ApplicationFiled: September 20, 2018Publication date: January 24, 2019Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
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Patent number: 10111356Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: GrantFiled: March 31, 2016Date of Patent: October 23, 2018Assignee: Oracle International CorporationInventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
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Publication number: 20170290190Abstract: Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors.Type: ApplicationFiled: March 31, 2016Publication date: October 5, 2017Inventors: Stephen Lindquist, William Izzicupo, Lyne Dore, Todd Ellsworth, Daniela Buchman
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Patent number: 6944023Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.Type: GrantFiled: October 10, 2003Date of Patent: September 13, 2005Assignee: Celestica International Inc.Inventors: John Bird, Paul Bussiere, Lyne Doré-North, Amy Allen, Ralph I. Larson
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Patent number: 6912128Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.Type: GrantFiled: August 8, 2002Date of Patent: June 28, 2005Assignee: Celestica International Inc.Inventors: John Bird, Ralph I. Larson, Lyne Doré North, Paul Bussiere, Amy Allen
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Publication number: 20040095728Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.Type: ApplicationFiled: October 10, 2003Publication date: May 20, 2004Applicant: Celestica International Inc.Inventors: John Bird, Paul Bussiere, Lyne Dore-North, Amy Allen, Ralph I. Larson
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Patent number: 6719038Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.Type: GrantFiled: August 8, 2002Date of Patent: April 13, 2004Assignee: Celestica International Inc.Inventors: John Bird, Ralph I. Larson, Lyne Doré North, Paul Bussiere, Amy Allen
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Publication number: 20030066626Abstract: The present invention comprises a heatsink adjacent a first device wherein a gas supply can be located to provide gas in any direction with respect to the heatsink. The gas supply may be realized as a fan, a blower, or a compressed gas source. The gas supply may be provided in any direction or in multiple directions. The heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises a radial shaped folded fin heatsink arranged for axial flow.Type: ApplicationFiled: October 3, 2002Publication date: April 10, 2003Inventors: John Bird, Ralph I. Larson, Lyne Dore North, Paul Bussiere, Amy Allen
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Publication number: 20030030980Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.Type: ApplicationFiled: August 8, 2002Publication date: February 13, 2003Inventors: John Bird, Ralph I Larson, Lyne Dore North, Paul Bussiere, Amy Allen
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Publication number: 20030029602Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.Type: ApplicationFiled: August 8, 2002Publication date: February 13, 2003Inventors: John Bird, Ralph I. Larson, Lyne Dore North, Paul Bussiere, Amy Allen