Abstract: The present invention relates to a device for assessing localized heat resulting from underlying injury in horses, or other mammals, through thermal imaging employing thermochromic liquid crystal displays and methods for their use. The device of the present invention comprises a wrap made of flexible fabric, and incorporates a sheet or sheets of thermochromic liquid crystal material as “windows”, held securely against possible injury sites. A method is claimed of detecting underlying injury in mammals by (a) applying a thermal imaging wrap to an area that is suspected of harboring an injury, (b) applying a second thermal imaging wrap in a parallel or bilateral region not suspected of harboring an injury, and comparing the results of (a) and (b). Besides horses, other mammals, such as dogs, donkeys, mules, llamas, camels, and humans may likewise be evaluated.

Abstract: The specification describes silicon MOS devices with gate dielectrics having the composition Ta1−xAlxOy, where x is 0.03-0.7 and y is 1.5-3, Ta1−xSixOy, where x is 0.05-0.15, and y is 1.5-3, and Ta1−x−zAlxSizOy, where 0.7>x+z>0.05, z<0.15 and y is 1.5-3. By comparison with the standard SiO2 gate dielectric material, these materials provide improved dielectric properties and also remain essentially amorphous to high temperatures. This retards formation of SiO2 interfacial layers which otherwise dominate the gate dielectric properties and reduce the overall effectiveness of using a high dielectric material.

Abstract: The thermo-optic behavior of an optical path over a range of temperatures &Dgr;T is controlled by determining a figure-of-merit (FOM) for the optical path and including in the path a body of crystalline material that enables the conditions specified by the FOM to be satisfied. The crystalline material is highly transparent at a wavelength &lgr; of radiation propagating in the path, and it has a coefficient of thermal expansion (CTE) and a refractive index n such that the CTE and dn/dT are mutually adapted to satisfy the FOM over the range &Dgr;T. In one embodiment, the CTE and dn/dT of an etalon compensate one another so as to perform frequency discrimination that is essentially temperature insensitive over the range &Dgr;T. In a preferred embodiment of the optical etalon the crystalline material comprises LiCaAlF6.

Abstract: The specification describes stepped etalon structures and techniques for their fabrication. The preferred etalon material is LiCaAlF6, which is not efficiently processed using reactive ion etching. The approach of the invention is to produce the steps on the etalon by depositing a blanket layer of step material that is effectively etched by RIE, masking a portion of the step material, and etching the masked blanket layer using the LiCaAlF6 substrate as an etch stop. These process steps may be repeated to form multiple steps on the etalon. Etalon structures with steps on both major surfaces are described, as well as etalon structures with steps having differing areas. In the latter case a difference in amplitude in the output signal from a single detector can be used to identify the step that is resonating.

Abstract: The invention relates to dielectric materials comprising films of R—Ge—Ti—O where R is selected from Zr and Hf, and to methods of making the same. The dielectric material preferably has the formula Rx—Gey—Tiz—Ow where 0.05≧x≦1, 0.05≧y≦1, 0.1≧z≦1, and 1≧w≦2, and x+y+z≅1, and more preferably, where 0.15≧x≦0.7, 0.05≧y≦0.3, 0.25≧z≦0.7, and 1.95≧w≦2.05, and x+y+z≅1. The invention is particularly useful in silicon-chip integrated circuit devices including a capacitor of a dynamic random access memory (DRAM) device.

Abstract: In accordance with the invention, an improved optical communication system employs light-generating devices comprising a phonon-tuned crystal alloy host doped with an optically active atom. In one embodiment, the crystal alloy host and optically active atom respectively comprise spinel and nickel. The spinel material is typically a solid solution between magnesium aluminate and magnesium gallate.

Abstract: The specification describes silicon MOS devices with gate dielectrics having the composition Ta.sub.1-x Al.sub.x O.sub.y, where x is 0.03-0.7 and y is 1.5-3, Ta.sub.1-x Si.sub.x O.sub.y, where x is 0.05-0.15, and y is 1.5-3, and Ta.sub.1-x-z Al.sub.x Si.sub.z O.sub.y, where 0.7>x+z>0.05, z<0.15 and y is 1.5-3. By comparison with the standard SiO.sub.2 gate dielectric material, these materials provide improved dielectric properties and also remain essentially amorphous to high temperatures. This retards formation of SiO.sub.2 interfacial layers which otherwise dominate the gate dielectric properties and reduce the overall effectiveness of using a high dielectric material.

Abstract: A dielectric layer consisting essentially of Ta, Al, oxygen and nitrogen can have advantageous properties that make such a layer useful for thin film capacitors, typically capacitors for Si integrated circuits. For instance, a significantly greater fraction of capacitors according to the invention than of prior art tantalum oxide capacitors can store a charge of 3 .mu.coulomb/cm.sup.2. In a currently preferred embodiment, the dielectric layer has composition Ta.sub.1-y Al.sub.y O.sub.x N.sub.z, with y.about.0.1, x.about.2.4, and z.about.0.02. The dielectric layer can be formed by sputter deposition or any other appropriate deposition technique, e.g., chemical vapor deposition.

Abstract: A thin dielectric film that uses an amorphous composition of R--Sn--Ti--O as the main component is disclosed, wherein R is Zr or Hf, having particular application for use in a capacitor of a DRAM cell. The preferable range of the dielectric thin film composition is centered around Zr.sub.x Sn.sub.y Ti.sub.z O.sub.w, where 0.1.ltoreq.x.ltoreq.1.8; 0.1.ltoreq.y.ltoreq.1.6; 0.2.ltoreq.z.ltoreq.1.9; and 2.0.ltoreq.w.ltoreq.4.0; and x+y+z=2. Preferably, x is about 0.2, y is about 0.2, and z is about 0.6. Doping of the composition with nitrogen is further disclosed as improving the dielectric properties and uniformity of the film.

Abstract: This invention is predicated on the discovery by the present applicants that boric acid in conventional nickel plating baths is responsible for excessive lateral growth in the electroplating of nickel on nickel ferrite substrates. While nickel baths without boric acid do not yield acceptable electrodeposits, the boric acid interacts with the ferrite substrate to cause excessive lateral growth. Applicants further discovered that by eliminating the boric acid and adding another acidic plating buffer such as citric acid, one can obtain isotropic nickel plating and produce a wire-bondable surface.