Abstract: A sample mount and method is disclosed for securing a semiconductor wafer sample to a generic base of a scanning electron microscope. The mount has two opposing clamp members that move relative to one another in response to rotational input to a lead screw. By placing a sample between the clamp members and rotating the lead screw, the samples may be clamped for inspection. When inspection is complete, the lead screw may be rotated in the opposite direction to release the clamping hold on the sample. The clamp members are adjustable to hold varying thicknesses and numbers of specimens making up the sample. In one embodiment, both clamp members move symmetrically from a common origin. In yet another embodiment, one clamp member is fixed relative to the mount and the other clamp member moves relative thereto.

Abstract: A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.

Abstract: A sample mount and method is disclosed for securing a semiconductor wafer sample to a generic base of a scanning electron microscope. The mount has two opposing clamp members that move relative to one another in response to rotational input to a lead screw. By placing a sample between the clamp members and rotating the lead screw, the samples may be clamped for inspection. When inspection is complete, the lead screw may be rotated in the opposite direction to release the clamping hold on the sample. The clamp members are adjustable to hold varying thicknesses and numbers of specimens making up the sample. In one embodiment, both clamp members move symmetrically from a common origin. In yet another embodiment, one clamp member is fixed relative to the mount and the other clamp member moves relative thereto.

Abstract: A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.

Abstract: A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.

Abstract: A method of manufacturing semiconductor devices using an improved planarization processes for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.

Abstract: A sample mount and method is disclosed for securing a semiconductor wafer sample to a generic base of a scanning electron microscope. The mount has two opposing clamp members that move relative to one another in response to rotational input to a lead screw. By placing a sample between the clamp members and rotating the lead screw, the samples may be clamped for inspection. When inspection is complete, the lead screw may be rotated in the opposite direction to release the clamping hold on the sample. The clamp members are adjustable to hold varying thicknesses and numbers of specimens making up the sample. In one embodiment, both clamp members move symmetrically from a common origin. In yet another embodiment, one clamp member is fixed relative to the mount and the other clamp member moves relative thereto.

Abstract: A sample mount and method is disclosed for securing a semiconductor wafer sample to a generic base of a scanning electron microscope. The mount has two opposing clamp members that move relative to one another in response to rotational input to a lead screw. By placing a sample between the clamp members and rotating the lead screw, the samples may be clamped for inspection. When inspection is complete, the lead screw may be rotated in the opposite direction to release the clamping hold on the sample. The clamp members are adjustable to hold varying thicknesses and numbers of specimens making up the sample. In one embodiment, both clamp members move symmetrically from a common origin. In yet another embodiment, one clamp member is fixed relative to the mount and the other clamp member moves relative thereto.

Abstract: A method of manufacturing semiconductor devices using an improved planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.

Abstract: A sample mount and method is disclosed for securing a semiconductor wafer sample to a generic base of a scanning electron microscope. The mount has two opposing clamp members that move relative to one another in response to rotational input to a lead screw. By placing a sample between the clamp members and rotating the lead screw, the samples may be clamped for inspection. When inspection is complete, the lead screw may be rotated in the opposite direction to release the clamping hold on the sample. The clamp members are adjustable to hold varying thicknesses and numbers of specimens making up the sample. In one embodiment, both clamp members move symmetrically from a common origin. In yet another embodiment, one clamp member is fixed relative to the mount and the other clamp member moves relative thereto.

Abstract: A wafer sample retainer for an electron microscope includes a clamp arranged to engage one or more wafer samples against a post. The clamp may be spring biased and may be operable by depressing a portion of a spring biased member to pivot the spring biased member away from a support post to create an opening to receive the samples. The sample holder may be removably mounted on a base which may be positioned using a conventional electron microscope positioner.