Abstract: An electrical connector of the type having a housing with terminals extending from apertures thereof, is sealed at the aperture entrances around the extending terminal portions. The sealant material is polymerized of a major proportion of at least one vinyl ester resin, a minor proportion of at least one polymerizable acrylic diluent monomer and a polymerization activation system comprising from about 0.025% to about 17% by weight of the resin, by being exposed to actinic radiation selected to activate the system. The polymerized material excludes solder and solvents from the aperture entrances.

Abstract: A dielectric composition capable of being polymerized for use in sealing electrical and electro-optical connectors and devices is disclosed. Said composition is comprised of a major proportion of vinyl ester resins, a minor proportion of polymerizable acrylic diluent monomers, and a polymerization activation system comprised of from about 0.25 percent to about 17 percent by weight of the resin. A process of the present invention includes applying a layer of said composition to desired areas or to desired locations such as apertures surrounding electrical terminals extending from a connector housing, and exposing said composition to actinic radiation which activates the polymerization activation system which causes the composition to polymerize to form a sealant material that exclused solder and solvents from the connector and its apertures.

Abstract: A sealant material that is relatively chemically inert toward plastics and adhesives is comprised of a homogeneous mixture of polymeric adipate polyester and fumed silica, the polyester comprising about 80 to 85 percent by weight of the mixture and the fumed silica comprising about 15 percent to 20 percent by weight of the mixture. In the preferred embodiment, the sealant material further contains about 0.02 to 0.04 percent of an organofunctional silane and about 0.03 percent to 0.07 percent of a fluorosurfactant.