Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.

Abstract: A printed circuit board includes a bore having a perimeter and a total depth. An electrically conductive barrel extends around at least a portion of the perimeter of the bore and along a predetermined depth of the bore, the predetermined depth being less than the total depth of the bore. The barrel has an end that terminates at a countersunk portion of the bore. A contact includes a body having first and second ends. The first end includes a compliant section that is positioned in the barrel, thereby forming a separable interface between the contact and the circuit board. The second end extends out of the barrel and interfaces with an electrical component. Protrusion of the first end out of the barrel is minimized. The above relationships are used to decrease capacitive loading.

Abstract: The invention relates to a variable orientation, surface mountable connector assembly. Electrical connector 1 comprises an insulative housing 100, a plurality of electrical contacts 200, and a pair of variable orientation board mounts 300. The electrical contacts 200 are mounted in the insulative housing 100 so as to be surface mountable to a printed circuit board 3 regardless of whether the electrical connector 1 is surface mounted vertically or horizontally. Two board mounts 300 are located in corresponding lateral cavities 125 in the insulative housing 100. Each board mount 300 is adapted to be selectively oriented in either a first position corresponding to a vertically mounted electrical connector 1 or a second position corresponding to a horizontally mounted electrical connector 1.

Abstract: The invention relates to a variable orientation, surface mountable hermaphroditic connector assembly comprising two hermaphroditic electrical connectors 1. Each hermaphroditic electrical connector 1 comprises an insulative housing 100, a plurality of electrical contacts 200, and a pair of variable orientation board mounts 300. The electrical contacts 200 are mounted in the insulative housing 100 so as to be surface mountable to a printed circuit board 3 regardless of whether the hermaphroditic electrical connector 1 is surface mounted vertically or horizontally. Two board mounts 300 are located in corresponding lateral cavities 125 in the insulative housing 100. Each board mount 300 is adapted to be selectively oriented in either a first position corresponding to a vertically mounted electrical connector 1 or a second position corresponding to a horizontally mounted electrical connector 1.

Abstract: A shunted connector assembly (14) wherein the electrical connector (12) has a housing (22) with spaced contacts (18), each having an exposed contact portion along an open portion of a side wall (30) of the housing. A shell member (64) is mounted to the connector housing and a shunt contact support housing (66) is slidably mounted to the shell member. The shunt contact support housing is movable generally linearly between first and second positions. When the shunt contact support housing is in the first position, shunt contacts (68, 70) secured therein engage pairs of spaced contacts (18) of the connector. When the shunt contact support housing is in the second position, the shunt contacts are electrically isolated from the connector contacts.