Patents by Inventor Lynne E. Dellis

Lynne E. Dellis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers
    Patent number: 8409963
    Abstract: Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: April 2, 2013
    Assignee: CDA Procesing Limited Liability Company
    Inventors: Lynne E. Dellis, Karl Hartmann Dietz, David Ross McGregor
  • Thin-film capacitor structures embedded in semiconductor packages and methods of making
    Patent number: 8391017
    Abstract: Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: March 5, 2013
    Assignee: Georgia Tech Research Corporation
    Inventors: David Ross McGregor, Cheong-Wo Hunter Chan, Lynne E. Dellis, Fuhan Liu, Deepukumar M. Nair, Venkatesh Sundaram
  • METHODS OF EMBEDDING THIN-FILM CAPACITORS INTO SEMICONDUCTOR PACKAGES USING TEMPORARY CARRIER LAYERS
    Publication number: 20100270644
    Abstract: Disclosed are methods of making a semiconductor package comprising at least one thin-film capacitor embedded into at least one build-up layer of said semiconductor package. A thin-film capacitor is provided wherein the thin-film capacitor has a first electrode and a second electrode separated by a dielectric. A temporary carrier layer is applied to the first electrode and the second electrode is patterned. A PWB core and a build-up material are provided, and the build-up material is placed between the PWB core and the patterned second electrode of said thin-film capacitor. The patterned electrode side of the thin-film capacitor is laminated to the PWB core by way of the build-up material, the temporary carrier layer is removed, and the first electrode is patterned.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 28, 2010
    Applicant: E. I. DU PONT DE NEMOURS AND COMPANY
    Inventors: Lynne E. Dellis, Karl Hartmann Dietz, David Ross McGregor
  • THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES AND METHODS OF MAKING
    Publication number: 20100270646
    Abstract: Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 28, 2010
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: CHEONG-WO HUNTER CHAN, Lynne E. Dellis, Fuhan Liu, David Ross McGregor, Venkatesh Sundaram, Deepukumar M. Nair
  • THIN-FILM CAPACITOR STRUCTURES EMBEDDED IN SEMICONDUCTOR PACKAGES AND METHODS OF MAKING
    Publication number: 20100270645
    Abstract: Provided are semiconductor packages comprising at least one thin-film capacitor attached to a printed wiring board core through build-up layers, wherein a first electrode of the thin-film capacitor comprises a thin nickel foil, a second electrode of the thin-film capacitor comprises a copper electrode, and a copper layer is formed on the nickel foil. The interconnections between the thin-film capacitor and the semiconductor device provide a low inductance path to transfer charge to and from the semiconductor device. Also provided are methods for fabricating such semiconductor packages.
    Type: Application
    Filed: April 20, 2010
    Publication date: October 28, 2010
    Applicant: GEORGIA TECH RESEARCH CORPORATION
    Inventors: DAVID ROSS MCGREGOR, Cheong-Wo Hunter Chan, Lynne E. Dellis, Fuhan Liu, Deepukumar M. Nair, Venkatesh Sundaram