Patents by Inventor M. Baris Dogruoz
M. Baris Dogruoz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940233Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.Type: GrantFiled: January 21, 2021Date of Patent: March 26, 2024Assignee: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mehmet Onder Cap, D. Brice Achkir, Joel Richard Goergen
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Patent number: 11917793Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.Type: GrantFiled: January 11, 2021Date of Patent: February 27, 2024Assignee: CISCO TECHNOLOGY, INC.Inventors: Mark Nowell, M. Baris Dogruoz, Mandy Hin Lam, Rakesh Chopra
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Publication number: 20230221510Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of a pluggable module within the enclosure when the pluggable module is inserted within the opening at the first end of the cage.Type: ApplicationFiled: March 21, 2023Publication date: July 13, 2023Inventors: Joel Richard Goergen, Paolo Sironi, Giovanni Giobbio, M. Baris Dogruoz
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Publication number: 20230209767Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Inventors: M. Baris Dogruoz, Mark Nowell, Yi Tang, Rakesh Chopra, Mandy Hin Lam
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Patent number: 11650385Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.Type: GrantFiled: November 17, 2021Date of Patent: May 16, 2023Assignee: CISCO TECHNOLOGY, INC.Inventors: Joel Richard Goergen, Paolo Sironi, Giovanni Giobbio, M. Baris Dogruoz
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Patent number: 11647607Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.Type: GrantFiled: January 22, 2021Date of Patent: May 9, 2023Assignee: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mark Nowell, Yi Tang, Rakesh Chopra, Mandy Hin Lam
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Publication number: 20230124658Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.Type: ApplicationFiled: October 28, 2022Publication date: April 20, 2023Inventors: M. Baris Dogruoz, Mandy Hin Lam, Mark Nowell, Rakesh Chopra
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Patent number: 11523541Abstract: Presented herein is a plurality of arrangements of cold plates having interior chambers. The interior chamber includes a plurality of fins with a first fin zone and a second fin zone. The cold plate further includes a first fluid inlet and a first fluid outlet. The cold plates can be connected such that each cold plate allows unidirectional flow or counter flow configurations. Unidirectional flow or counter flow cold plates can be arranged in rows and in combination of rows.Type: GrantFiled: July 14, 2020Date of Patent: December 6, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mandy Hin Lam, Mark Nowell, Rakesh Chopra
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Patent number: 11439041Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.Type: GrantFiled: July 7, 2020Date of Patent: September 6, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, M. Baris Dogruoz, Mark Nowell, Mandy Hin Lam
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Publication number: 20220244472Abstract: A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.Type: ApplicationFiled: November 17, 2021Publication date: August 4, 2022Inventors: Joel Richard Goergen, Paolo Sironi, Giovanni Giobbio, M. Baris Dogruoz
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Publication number: 20220240419Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.Type: ApplicationFiled: April 14, 2022Publication date: July 28, 2022Inventors: M. Baris Dogruoz, Joel Goergen
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Publication number: 20220239198Abstract: In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.Type: ApplicationFiled: January 22, 2021Publication date: July 28, 2022Applicant: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mark Nowell, Yi Tang, Rakesh Chopra, Mandy Hin Lam
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Publication number: 20220228820Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.Type: ApplicationFiled: January 21, 2021Publication date: July 21, 2022Applicant: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Mehmet Onder Cap, D. Brice Achkir, Joel Richard Goergen
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Publication number: 20220225537Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.Type: ApplicationFiled: January 11, 2021Publication date: July 14, 2022Applicant: CISCO TECHNOLOGY, INC.Inventors: Mark Nowell, M. Baris Dogruoz, Mandy Hin Lam, Rakesh Chopra
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Patent number: 11357132Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.Type: GrantFiled: July 7, 2020Date of Patent: June 7, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, M. Baris Dogruoz, Mark Nowell, Mandy Hin Lam
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Patent number: 11343945Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.Type: GrantFiled: November 27, 2019Date of Patent: May 24, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: M. Baris Dogruoz, Joel Goergen
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Patent number: 11252811Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.Type: GrantFiled: January 15, 2020Date of Patent: February 15, 2022Assignee: CISCO TECHNOLOGY, INC.Inventors: Joel Richard Goergen, Jessica Kiefer, Ashley Julia Maker Erickson, Yi Tang, M. Baris Dogruoz, Elizabeth Ann Kochuparambil, Shobhana Punjabi
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Publication number: 20220039291Abstract: A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.Type: ApplicationFiled: October 18, 2021Publication date: February 3, 2022Inventors: Rakesh Chopra, Mandy Hin Lam, M. Baris Dogruoz, Joel Richard Goergen
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Patent number: 11191185Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.Type: GrantFiled: January 22, 2020Date of Patent: November 30, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Rakesh Chopra, Mandy Hin Lam, M. Baris Dogruoz, Joel Richard Goergen
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Patent number: 11184994Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.Type: GrantFiled: May 18, 2018Date of Patent: November 23, 2021Assignee: CISCO TECHNOLOGY, INC.Inventors: Mandy Hin Lam, Vic Hong Chia, M. Baris Dogruoz