Patents by Inventor M. C. KAO

M. C. KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL MICROLENS STRUCTURE FOR CIS SENSITIVITY IMPROVEMENT
    Publication number: 20080007839
    Abstract: A method of manufacturing a microlens device by depositing a microlens material layer over a substrate that includes photo-sensors. The microlens material layer is then exposed and developed to define microlens material elements, including first microlens material elements and second microlens material elements. Each second microlens material element is substantially greater in thickness relative to each first microlens material element. The microlens material elements are then heated to form a microlens array that includes first microlens array elements, each corresponding to a first microlens material element, and second microlens array elements, each corresponding to a second microlens material element. Each first microlens array element has a substantially greater focal length relative to each second microlens array element. For example, each second microlens array element is substantially greater in thickness relative to each first microlens array element.
    Type: Application
    Filed: July 10, 2006
    Publication date: January 10, 2008
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jack DENG, Chih-Kung CHANG, Chin Chen KUO, M. C. KAO, Fu-Tien WENG, Bii-Junq CHANG