Patents by Inventor M. Chapman

M. Chapman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060100502
    Abstract: In another preferred form of the present invention, there is provided a method for determining the risk of rupture of a blood vessel using an appropriate set of 2-D slice images obtained by scanning the blood vessel, the method comprising: generating a mesh model of the blood vessel using the set of 2-D slice images; conducting finite element stress analysis on the mesh model to calculate the level of stress on different locations on the mesh model; and determining the risk of rupture of the blood vessel based on the calculated levels of stress on different locations on the mesh model.
    Type: Application
    Filed: June 23, 2005
    Publication date: May 11, 2006
    Inventors: David Chen, Jeff Dwyer, Mark Fillinger, Steven Marra, M. Chapman
  • Patent number: 7043632
    Abstract: A method and apparatus for managing a data transmission in a network is provided, which has a client, a real server and a load-balancing node (virtual server). The load-balancing node includes a handshake executor for handling a security protocol to establish a handshake between a client and a server, and a communication executor for establishing a direct communication between the client and the server using a session information in respect to the established handshake. The handshake executor establishes the handshake with the client. When the handshake is established, the communication executor exports session information in respect to the established handshake. The client establishes TCP/IP connection with the server. The client and server communicate each other directly.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: May 9, 2006
    Assignee: Nortel Networks Limited
    Inventors: Diana M. Chapman, Abulkadev Barbir
  • Patent number: 7026511
    Abstract: A process to produce N-vinylformamide includes the steps of: reacting hydroxyethyl formamide with a reactant comprising at least one cyclic anhydride group to form an ester, and dissociating the ester via heat in a thin film evaporation to synthesize N-vinylformamide and a compound comprising at least one diacid group, the N-vinylformamide separating from the diacid during the thin film evaporation. The reactant including at least one cyclic anhydride group can, for example, be succinic anhydride, maleic anhydride, phthalic anhydride, (2-docecen-1-yl)succinic anhydride, exo-3,6-epoxy-1,2,3,6-tetrahydrophthalic anhydride or a polymer including at least one cyclic anhydride group.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: April 11, 2006
    Assignees: University of Pittsburgh, SNF SA
    Inventors: Eric J. Beckman, Toby M. Chapman, Cedrick Favero, Christopher C. Capelli, Harold E. Swift, William Eamon Carroll
  • Patent number: 6966480
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: November 22, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Patent number: 6965052
    Abstract: A process to produce N-vinylformamide includes the steps of: reacting hydroxyethyl formamide with a reactant including at least one cyclic anhydride group to form an ester, and dissociating (or cracking) the ester to synthesize N-vinylformamide and a compound including at least one diacid group. The ester can be dissociated using heat. The reactant including at least one cyclic anhydride group can, for example, be succinic anhydride, maleic anhydride, phthalic anhydride, a polymer including at least one cyclic anhydride group, or a solid support to which at least one cyclic anhydride group is covalently tethered. Preferably, the cyclic anhydride is regenerated from the diacid formed in the synthesis of the ester by heating the diacid to dehydrate the diacid. The temperature required to dehydrate diacid groups is preferably higher than the temperature use to dissociate the ester.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: November 15, 2005
    Assignees: University of Pittsburgh, SNF SA
    Inventors: Eric J. Beckman, Tody M. Chapman, Cedrick Gilbert Favero, Christopher C. Capelli, Harold E. Swift
  • Patent number: 6956272
    Abstract: A semiconductor die package having an elastomeric substrate with a first support frame and a second support frame. The first support frame has a cavity within which a semiconductor die is placed. The second support frame may have an optional cavity. The optional cavity in the second support frame may have an optional rigid structure. The rigid structure may have a heating element formed within it.
    Type: Grant
    Filed: March 10, 2004
    Date of Patent: October 18, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Gregory M. Chapman
  • Publication number: 20050213800
    Abstract: A method and apparatus for generating a computer model from scan data from a patient, comprising: (1) acquiring the scan data from the patient; (2) selecting a plurality of key frames from the scan data; (3) hand segmenting the selected key frames, whereby to identify specific anatomical structures; (4) automatically generating segmented intervening frames for the regions between the key frames using an interpolation process; (5) merging the automatically segmented intervening frames with the hand segmented key frames so as to generate a complete set of segmented frames; (6) obtaining a first measurement of a selected feature of the complete set of segmented frames; (7) hand segmenting at least one additional key frame and replacing a corresponding intervening frame with said one additional key frame within the complete set of segmented frames; (8) re-interpolating the set of segmented frames based upon the updated set of key frames; (9) obtaining a second measurement of the selected feature of the re-compute
    Type: Application
    Filed: July 15, 2004
    Publication date: September 29, 2005
    Inventors: David Chen, M. Chapman, Haoning Fu
  • Publication number: 20050147283
    Abstract: A computer-based visualization system for visualizing anatomical structure and a graft implant to be deployed adjacent the anatomical structure, comprising: a 3-D computer model of the anatomical structure to be visualized, the 3-D computer model comprising at least one first software object which corresponds to the anatomical structure to be visualized; a database of second software objects, wherein at least one of the second software objects corresponds to a graft implant which is to be deployed adjacent the anatomical structure; selection apparatus for permitting a user to select at least one of the second software objects; registration apparatus for positioning the selected at least one of the second software objects into the 3-D computer model so as to create an augmented 3-D computer model; and processing apparatus for generating an image of the augmented 3-D computer model.
    Type: Application
    Filed: November 10, 2004
    Publication date: July 7, 2005
    Inventors: Jeff Dwyer, David Chen, M. Chapman
  • Patent number: 6907403
    Abstract: Provided is a technique for classifying stocks into business sectors by calculating, for each of multiple exogenous variables, a measure of a tendency for a value of a stock to change as a result of a change in a data value for each such exogenous variable. The foregoing step is then repeated for each of several different stocks. Finally, the different stocks are grouped into different sectors based on similarities of such measures of tendency to change.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: June 14, 2005
    Assignee: c4cast.com, Inc.
    Inventors: Stephen A. Klein, G. Michael Phillips, William P. Jennings, M. Chapman Findlay, III, Mark E. Rice
  • Patent number: 6890384
    Abstract: A method and apparatus for achieving a level exposed surface of a viscous material pool for applying viscous material to at least one semiconductor component by contacting at least a portion of the semiconductor component with viscous material within a reservoir. A level viscous material exposed surface is achieved by using at least one mechanism in association with the reservoir. The mechanism is configured to level the exposed surface of viscous material and maintain the exposed surface at a substantially constant level. The reservoir may be shaped such that the exposed surface of viscous material is supplied to a precise location.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: May 10, 2005
    Assignee: Micron Technology, INC
    Inventors: Walter L. Moden, Syed S. Ahmad, Gregory M. Chapman, Tongbi Jiang
  • Patent number: 6883574
    Abstract: A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.
    Type: Grant
    Filed: August 4, 2003
    Date of Patent: April 26, 2005
    Assignee: Micron Technology, Inc.
    Inventor: Gregory M. Chapman
  • Patent number: 6818460
    Abstract: A method for applying a viscous material to a lead frame element. A method of the invention includes positioning the lead frame facing downward and bringing the lead fingers into contact with a pool of adhesive material. The contact of the lead fingers to the adhesive material results in a portion of the lead fingers receiving a portion of the adhesive material from the pool of adhesive material. The gravitational forces on the adhesive material on the downward facing lead frame maintain the shape and boundary definition of the adhesive material.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: November 16, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Walter L. Moden, Syed S. Ahmad, Gregory M. Chapman, Tongbi Jiang
  • Publication number: 20040186319
    Abstract: A process to produce N-vinylformamide includes the steps of: reacting hydroxyethyl formamide with a reactant including at least one cyclic anhydride group to form an ester, and dissociating (or cracking) the ester to synthesize N-vinylformamide and a compound including at least one diacid group. The ester can be dissociated using heat. The reactant including at least one cyclic anhydride group can, for example, be succinic anhydride, maleic anhydride, phthalic anhydride, a polymer including at least one cyclic anhydride group, or a solid support to which at least one cyclic anhydride group is covalently tethered. Preferably, the cyclic anhydride is regenerated from the diacid formed in the synthesis of the ester by heating the diacid to dehydrate the diacid. The temperature required to dehydrate diacid groups is preferably higher than the temperature use to dissociate the ester.
    Type: Application
    Filed: August 29, 2003
    Publication date: September 23, 2004
    Inventors: Eric J. Beckman, Toby M. Chapman, Cedrick Gilbert Favero, Christopher C. Capelli, Harold E. Swift
  • Patent number: 6792399
    Abstract: Combination forecasts are generated using predictions obtained from a group of forecasters. The forecasters are first divided into a number of pre-defined clusters, which typically will have been formed using statistical clustering techniques. In particular, clusters of forecasters can be formed based on similarities of the forecasters' predictions. Then, statistical data are calculated for each pre-defined cluster (e.g., measures of central tendency and dispersion). Finally, the statistical data for all the pre-defined clusters are combined so as to obtain a combination forecast.
    Type: Grant
    Filed: September 8, 1999
    Date of Patent: September 14, 2004
    Assignee: c4cast.com, Inc.
    Inventors: G. Michael Phillips, William P. Jennings, M. Chapman Findlay, III, Stephen A. Klein, Mark E. Rice
  • Patent number: 6787382
    Abstract: A method for singulating a substrate containing semiconductor components is performed using a nest for holding the substrate, a prestage alignment base for aligning the substrate during a prestage alignment step, and a vacuum cutting base for holding the nest and the substrate during a cutting step. The prestage alignment base includes locator pins configured to engage locator openings on the substrate to align the substrate on the nest. As the cutting base does not include the locator pins, the cutting step can be performed without saw scrap collecting on the locator pins. A system for performing the method includes the nest and the prestage alignment base having the locator pins configured to engage the locator openings on the substrate. The system also includes the sawing base which includes pedestals with vacuum conduits for holding the substrate stationary on the nest for sawing.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jason C. Wing, Gregory M. Chapman
  • Publication number: 20040166298
    Abstract: A plastic masking film comprises at least two layers, an outer layer having sufficient surface energy to ensure the adherence of paint, and an inner layer providing cling to a surface. The outer layer comprises a corona-treated thermoplastic material having a surface with a surface energy greater than 50 dynes/cm. at the time of manufacture and which remains at a minimum of 35 dynes/cm. until use. The thermoplastic material of the outer layer comprises one or a combination of members selected from the group consisting of ethylene vinyl acetate, polyvinyl alcohol, polyvinyl acetate, ethylene vinyl alcohol, and high density polyethylene. The inner layer comprises high density polyethylene. Desirably, the film also includes a central core layer formed of one or a combination of polyolefins, preferably low-density polyethylene or linear low-density polyethylene, compatible with the inner and outer layers.
    Type: Application
    Filed: February 23, 2004
    Publication date: August 26, 2004
    Inventors: Graham M. Chapman, Adam K. Lowry, Paul C. Keiswetter, James K. Craig
  • Publication number: 20040167338
    Abstract: A method of synthesizing a compound having the formula: 1
    Type: Application
    Filed: September 5, 2003
    Publication date: August 26, 2004
    Inventors: Eric J. Beckman, Toby M. Chapman, Lianjun Shi
  • Patent number: 6744134
    Abstract: A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: June 1, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Jay Roberts, Gregory M. Chapman, John VanNortwick, Zane Drussel
  • Publication number: 20040056072
    Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.
    Type: Application
    Filed: July 22, 2003
    Publication date: March 25, 2004
    Inventors: Gregory M. Chapman, Michael J. Bettinger, Jennifer A. Due
  • Publication number: 20040033642
    Abstract: A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.
    Type: Application
    Filed: August 11, 2003
    Publication date: February 19, 2004
    Inventor: Gregory M. Chapman