Abstract: An integrated circuit structure with a metal-to-metal capacitor and a metallic device such as a resistor, effuse, or local interconnect where the bottom plate of the capacitor and the metallic device are formed with the same material layers. A process for forming a metallic device along with a metal-to-metal capacitor with no additional manufacturing steps.

Abstract: An integrated circuit structure with a metal-to-metal capacitor and a metallic device such as a resistor, effuse, or local interconnect where the bottom plate of the capacitor and the metallic device are formed with the same material layers. A process for forming a metallic device along with a metal-to-metal capacitor with no additional manufacturing steps.

Abstract: System, methods, and computer program products are provided for detecting and managing changes associated with a mobile wallet. Current mobile wallet data is retrieved from at least one memory, and new mobile device attributes are retrieved. It is determined whether a change has occurred based on a comparison of the current mobile wallet data and the new mobile device attributes. A request to process a change is transmitted to a server on a communications network. Update data is received over the communications network, and the current mobile wallet data is updated in the at least one memory with the update data.

Abstract: A TSV-MEMS packaging process is provided. The process includes forming TSVs in the front side of the product wafer, and attaching a first carrier to the front side of the product wafer, subsequent to forming TSVs. The process further includes thinning the back side of the product wafer to expose TSV tips, detaching the first carrier from the front side of the product wafer, and transferring the thinned wafer to a second carrier with back side adhered to the second wafer carrier. Semiconductor components are added to the front side of the product wafer, followed by forming a hermetic cavity over the added semiconductor components, and detaching the second carrier from the back side of the product wafer. Wafer level processing continues after detaching the second carrier.

Abstract: Disclosed is a method of fabricating an integrated circuit comprising patterning a dielectric layer to form a hole having a sidewall and a bottom. The hole can expose an underlying material of an electrically conducting material. The method also includes exposing the sidewall and the exposed underlying material to a plasma etch, depositing a barrier layer on the bottom and the sidewall of the hole after the plasma etch clean, forming a counter-sunk cone in the underlying material by etching through the barrier layer at the bottom of the hole into the conducting metal underneath, flash depositing a thin layer of the barrier material into the hole, and finally depositing a metal seed layer in the hole covering the sidewalls and the bottom of the hole including the cone at the bottom. The hole is finally filled by depositing a metal layer in the hole.

Abstract: An integrated circuit structure with a metal-to-metal capacitor and a metallic device such as a resistor, effuse, or local interconnect where the bottom plate of the capacitor and the metallic device are formed with the same material layers. A process for forming a metallic device along with a metal-to-metal capacitor with no additional manufacturing steps.

Abstract: A TSV-MEMS packaging process is provided. The process includes forming TSVs in the front side of the product wafer, and attaching a first carrier to the front side of the product wafer, subsequent to forming TSVs. The process further includes thinning the back side of the product wafer to expose TSV tips, detaching the first carrier from the front side of the product wafer, and transferring the thinned wafer to a second carrier with back side adhered to the second wafer carrier. Semiconductor components are added to the front side of the product wafer, followed by forming a hermetic cavity over the added semiconductor components, and detaching the second carrier from the back side of the product wafer. Wafer level processing continues after detaching the second carrier.

Abstract: The present invention provides a method of forming a metal seed layer 100. The method includes physical vapor deposition of seed metal 200 within an opening 140 located in a dielectric layer 135 of a substrate 110. The method also includes a RF plasma etch of the seed metal 200 deposited in the opening 140 simultaneously with conducting the physical vapor deposition of the seed metal 200.

Abstract: The present invention provides a method of forming a interconnect barrier layer 100. In the method, physical vapor deposition of barrier material 200 is performed within an opening 140 located in a dielectric layer 135 of a substrate 110. RF plasma etching of the barrier material 200 that is deposited in the opening 140 occurs simultaneously with conducting the physical vapor deposition of the barrier material 200.

Abstract: An injection device is provided. The device includes a housing having a first end defining a first opening. A plunger is received within the first opening of the housing to move between first and second positions. A cartridge is disposed in the housing and has an interior serving as a reservoir for a drug. A delivery needle is disposed within the housing and is in fluid communication with the reservoir via an interruptible fluid channel. A locking mechanism is disposed in the housing. In the first position of the plunger the delivery needle is enclosed by the plunger and in the second position of the plunger the delivery needle is placed in an injection position and the plunger activates the locking mechanism whereby when the plunger returns to the first position the locking mechanism prevents the needle from being placed in the injection position.

Abstract: An apparatus for delivering or withdrawing a fluid through at least one layer of the skin is provided. A device includes a body having a top face, a bottom face, a side edge and at least one channel. The bottom face includes a first surface area and a second surface area adjacent to and recessed at a first distance from the first surface area. The bottom face further includes at least one raised protrusion disposed on the second surface area. The protrusion has a height from the first surface greater than the first distance. At least one dermal-access member is provided in the protrusion and is in fluid communication with the channel to deliver or withdraw the fluid.

Abstract: A system and method is provided for an injectable substance delivery device comprising a limiter, shoulder or post, that controls how deep the needle is inserted into the tissue. The limiter is sized in proportions that control the maximum insertion depth of the needle into the tissue without excessively restricting the complete insertion of the needle. The system and method further comprises an normalization or stabilizer ring that prevents distortion of the tissue in the vicinity of the infusion, so that the needle length is the major determining factor as to how deep the infusion is delivered.

Abstract: An apparatus for delivering or withdrawing a fluid through at least one layer of the skin is provided. The device may include a body having a top face, a bottom face, a side edge and at least one channel. The bottom face includes a first surface area and a second surface area adjacent to and recessed at a first distance from the first surface area. The bottom face further includes at least one raised protrusion disposed on the second surface area. The protrusion has a height from the first surface greater than the first distance. At least one dermal-access member is provided in the protrusion and is in fluid communication with the channel to deliver or withdraw the fluid.

Abstract: A method of protecting an interconnect is provided. The method includes forming an integrated circuit structure having an interconnect, and depositing vaporized benzotriazole on the interconnect.

Abstract: A method of producing a tubular device is provided. The method comprises providing a tubular stock having an axial passage, heating the tubular stock at a first heating location to form a softened section, the softened section separating a workpiece portion of the tubular stock from a remaining portion of the tubular stock, and drawing the workpiece portion away from the remaining portion to elongate the softened section and separate the workpiece portion from the remaining portion to form the tubular device. The drawing is performed at a rate such that the tubular device has an axial passage having a substantially uniform inside diameter, and an end of the tubular device formed from the elongated softened section is tapered.

Abstract: A method of producing a tubular device is provided. The method comprises providing a tubular stock having an axial passage, heating the tubular stock at a first heating location to form a softened section, the softened section separating a workpiece portion of the tubular stock from a remaining portion of the tubular stock, and drawing the workpiece portion away from the remaining portion to elongate the softened section and separate the workpiece portion from the remaining portion to form the tubular device. The drawing is performed at a rate such that the tubular device has an axial passage having a substantially uniform inside diameter, and an end of the tubular device formed from the elongated softened section is tapered.

Abstract: A method and apparatus for epidermal and/or intradermal delivery of a substance is provided. A needle having at least one side port is used to penetrate the skin of a subject. The needle may be of any size. A substance is delivered through the side port and into the skin. The side port can be of any size or shape and be arranged at any location on the needle.

Abstract: Semiconductor devices and methods for making the same are described in which a single high k or ferroelectric dielectric layer is used to form decoupling capacitors and analog capacitor segments. Analog capacitors are formed by coupling analog capacitor segments in series with one another, wherein the capacitor segments may be connected in reverse polarity relationship to provide symmetrical performance characteristics for the analog capacitors.

Abstract: An apparatus for delivering or withdrawing a fluid through at least one layer of the skin is provided. A device includes a body having a top face, a bottom face, a side edge and at least one channel. The bottom face includes a first surface area and a second surface area adjacent to and recessed at a first distance from the first surface area. The bottom face further includes at least one raised protrusion disposed on the second surface area. The protrusion has a height from the first surface greater than the first distance. At least one dermal-access member is provided in the protrusion and is in fluid communication with the channel to deliver or withdraw the fluid. The dermal-access member extends at least 1 mm from the protrusion. A mechanism drives the device against the skin at a calculated speed of about 6 m/s to about 18 m/s.

Abstract: An apparatus for delivering or withdrawing a fluid through at least one layer of the skin is provided. A device includes a body having a top face, a bottom face, a side edge and at least one channel. The bottom face includes a first surface area and a second surface area adjacent to and recessed at a first distance from the first surface area. The bottom face further includes at least one raised protrusion disposed on the second surface area. The protrusion has a height from the first surface greater than the first distance. At least one dermal-access member is provided in the protrusion and is in fluid communication with the channel to deliver or withdraw the fluid.