Patents by Inventor M. J. Hampden-Smith

M. J. Hampden-Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for patterned deposition on a substrate
    Patent number: 5380474
    Abstract: A method is described for patterned depositions of a material onto a substrate. A surface of a polymeric substrate is first etched so as to form an etched layer having enhanced adhesions characteristics and then selected portions of the etched layer are removed so as to define a pattern having enhanced and diminished adhesion characteristics for the deposition of a conductor onto the remaining etched layer. In one embodiment, a surface of a PTFE substrate is chemically etched so as to improve the adhesion of copper thereto. Thereafter, selected portions of the etched surface are irradiated with a laser beam so as to remove the etched selected portions of the etched surface and form patterns of enhanced and diminished adhesion of copper thereto.
    Type: Grant
    Filed: May 20, 1993
    Date of Patent: January 10, 1995
    Assignee: Sandia Corporation
    Inventors: Robert R. Rye, Antonio J. Ricco, M. J. Hampden-Smith, T. T. Kodas