Abstract: Disclosed are a process and apparatus for selective catalytic reduction of NOx. The process is enabled by passing a heat exchanger section, such as an economizer, of the boiler in advance of an SCR unit at low load conditions to enable NOx reduction even at low loads using urea instead of ammonia. In a preferred form, under high load conditions, the bypass can be almost fully closed and the economizer can be operated normally without excessively cooling the combustion gases, using only a portion of bypassed gases which are hot enough to decompose the urea into its active components including ammonia.

Abstract: A lead-frame type semiconductor package is provided, including: a lead frame having a plurality of long leads and short leads, wherein a chip-attaching area is defined on the plurality of long leads, and at least a portion of each of the long leads within the chip-attaching area is formed with a recess; a chip mounted on the chip-attaching area and covering the recesses; a plurality of bonding wires for electrically connecting the chip to the corresponding long leads and short leads around the chip; and an encapsulant for encapsulating the chip, the plurality of bonding wires, a portion of the long leads and a portion of the short leads, wherein the encapsulant is filled into the recesses and gaps between the long leads, so as to solve a problem of incomplete filling in a conventional package.