Patents by Inventor Mónica LÓPEZ-LORENZO

Mónica LÓPEZ-LORENZO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11111632
    Abstract: An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: September 7, 2021
    Assignee: TEIJIN ARAMID B.V.
    Inventors: Antonius Hendriks, Mónica López-Lorenzo, Jan-Cees Tiecken, Frank Diedering
  • Publication number: 20190376237
    Abstract: An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.
    Type: Application
    Filed: November 27, 2017
    Publication date: December 12, 2019
    Applicant: TEIJIN ARAMID B.V.
    Inventors: Antonius HENDRIKS, Mónica LÓPEZ-LORENZO, Jan-Cees TIECKEN, Frank DIEDERING
  • Patent number: 10066341
    Abstract: A sheet material includes 30-70 wt. % of aramid pulp, 30-70 wt. % of a fire-retardant short fiber material selected from para-aramid, glass fibers, carbon fibers, and PEEK (polyether etherketone), and 0.5-15 wt. % of a polymer binder, wherein the sheet material is a non-woven sheet material having an areal weight of 10-70 g/m2. The sheet material is soft, pliable, and light weight. It can be applied as backing onto upholstery material without detrimentally affecting the properties thereof. At the same time, the sheet material has very good fire-retardant properties.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: September 4, 2018
    Assignee: TEIJIN ARAMID B.V.
    Inventors: Jan David Tiecken, Monica Lopez Lorenzo, Ben Rolink, Ernst Michael Winkler
  • Publication number: 20160160444
    Abstract: A sheet material includes 30-70 wt. % of aramid pulp, 30-70 wt. % of a fire-retardant short fiber material selected from para-aramid, glass fibers, carbon fibers, and PEEK (polyether etherketone), and 0.5-15 wt. % of a polymer binder, wherein the sheet material is a non-woven sheet material having an areal weight of 10-70 g/m2. The sheet material is soft, pliable, and light weight. It can be applied as backing onto upholstery material without detrimentally affecting the properties thereof. At the same time, the sheet material has very good fire-retardant properties.
    Type: Application
    Filed: July 3, 2014
    Publication date: June 9, 2016
    Applicant: TEIJIN ARAMID B.V.
    Inventors: Jan David TIECKEN, Monica LOPEZ LORENZO, Ben ROLINK, ERNST Michael WINKLER
  • Publication number: 20110083820
    Abstract: The invention relates to a paper comprising at least one of a fiber, pulp, fibril, floc, and fibrid having a polybenzazole structure with a repeating unit of formula (I) and/or (II) or its precursor structure with a repeating unit of formula (III): wherein Ar1 and Ar2 are independently a para or meta aromatic group having 4 to 12 carbon atoms, X and Y are the same or different and selected from O, S, and NH; and n is 0 or 1, and wherein the paper is free or essentially free of non-extractable phosphorus compound. The paper is particularly suitable for making an electrical insulation material, a honeycomb structure, or a constructive material.
    Type: Application
    Filed: September 2, 2008
    Publication date: April 14, 2011
    Applicant: TEIJIN ARAMID B.V.
    Inventors: Monica Lopez Lorenzo, Anton Peter De Weijer, Richard Visser