Patents by Inventor M. Tekamul Buber

M. Tekamul Buber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10979016
    Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: April 13, 2021
    Assignee: Maury Microwave, Inc.
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Patent number: 10651528
    Abstract: A directional coupler operable at microwave and RF frequencies. Embodiments of directional coupler includes a main transmission line supporting transverse electromagnetic (TEM) or quasi-TEM wave mode propagation. A coupled transmission line supports TEM or quasi-TEM wave mode propagation. The coupled transmission line is adjacent to and oriented at an angle with respect to the main transmission line. A coupling hole is formed through conductive shielding between the main and coupled lines, the coupling hole formed at an intersection region between the main and coupled lines. The angle is nominally 60 degrees for optimal directivity and isolation.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: May 12, 2020
    Assignee: Maury Microwave, Inc.
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Patent number: 10652051
    Abstract: A load pull system and method for calibrating the system and conducting measurements on a Device Under Test (DUT). The system includes at least one passive tuner; and a modulated signal connected to the DUT input. The passive tuner is calibrated at multiple frequencies within the modulation bandwidth of the modulated signal. The impedance and measured quantities such as power at the DUT reference plane are determined using tuner s-parameters at multiple frequencies within the modulation bandwidth.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 12, 2020
    Assignee: Maury Microwave, Inc.
    Inventors: Gary R. Simpson, Sathya Padmanabhan, Steven M. Dudkiewicz, M. Tekamül Büber, Giampiero Esposito
  • Publication number: 20200119707
    Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. The multi- section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.
    Type: Application
    Filed: December 12, 2019
    Publication date: April 16, 2020
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Patent number: 10560067
    Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. Each section of the multi-section probe has a nominal length equal to one quarter wavelength at a midpoint of the operating band. The tapered probe has a length equivalent to a plurality of one quarter wavelengths of the frequency midpoint. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: February 11, 2020
    Assignee: Maury Microwave, Inc.
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Publication number: 20190222191
    Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. Each section of the multi-section probe has a nominal length equal to one quarter wavelength at a midpoint of the operating band. The tapered probe has a length equivalent to a plurality of one quarter wavelengths of the frequency midpoint. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.
    Type: Application
    Filed: January 17, 2018
    Publication date: July 18, 2019
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Publication number: 20190165445
    Abstract: A directional coupler operable at microwave and RF frequencies. Embodiments of directional coupler includes a main transmission line supporting transverse electromagnetic (TEM) or quasi-TEM wave mode propagation. A coupled transmission line supports TEM or quasi-TEM wave mode propagation. The coupled transmission line is adjacent to and oriented at an angle with respect to the main transmission line. A coupling hole is formed through conductive shielding between the main and coupled lines, the coupling hole formed at an intersection region between the main and coupled lines. The angle is nominally 60 degrees for optimal directivity and isolation.
    Type: Application
    Filed: November 27, 2017
    Publication date: May 30, 2019
    Inventors: M. Tekamül Büber, Sathya Padmanabhan
  • Publication number: 20190081822
    Abstract: A load pull system and method for calibrating the system and conducting measurements on a Device Under Test (DUT). The system includes at least one passive tuner; and a modulated signal connected to the DUT input. The passive tuner is calibrated at multiple frequencies within the modulation bandwidth of the modulated signal. The impedance and measured quantities such as power at the DUT reference plane are determined using tuner s-parameters at multiple frequencies within the modulation bandwidth.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 14, 2019
    Inventors: Gary R. Simpson, Sathya Padmanabhan, Steven M. Dudkiewicz, M. Tekamül Büber, Giampiero Esposito
  • Patent number: 9614267
    Abstract: Embodiments of a broadband capacitor in a coaxial line are described. A capacitor may be realized in the center conductor of the coaxial line, and this aspect has two different embodiments. One embodiment forms the capacitor between the flat faces of an interrupted inner conductor structure. A second embodiment forms the capacitor between overlapping fingers of the female inner conductor and the male inner conductor, where the fingers can be realized in different ways. In another embodiment, a capacitor is realized in the outer conductor of the coaxial line, between fingers of a female portion of the outer conductor and a male portion of the outer conductor, where the fingers can be realized in different ways.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: April 4, 2017
    Assignee: Maury Microwave, Inc.
    Inventors: M. Tekamül Büber, Sathya Padmanabhan, Bruce J. Pluth
  • Patent number: 8414720
    Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.
    Type: Grant
    Filed: June 21, 2010
    Date of Patent: April 9, 2013
    Assignee: Weyerhaeuser NR Company
    Inventors: Mark T. Churchland, M. Tekamul Buber
  • Publication number: 20110308695
    Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.
    Type: Application
    Filed: June 21, 2010
    Publication date: December 22, 2011
    Applicant: WEYERHAEUSER NR COMPANY
    Inventors: Mark T. Churchland, M. Tekamul Buber
  • Patent number: 6891266
    Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: May 10, 2005
    Assignee: MIA-com
    Inventors: Noyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
  • Patent number: 6657522
    Abstract: A wide bandwidth bias tee including a high frequency terminal, a first resistor coupled between the high frequency terminal and a capacitor, a second resistor coupled to the capacitor, the second resistor coupled in series with the first resistor, and a low frequency terminal, the low frequency terminal coupled to the second resistor.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: December 2, 2003
    Assignee: M/A-Com
    Inventors: M. Tekamul Buber, Adil Khalil, Robert Ian Gresham
  • Publication number: 20030151133
    Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
    Type: Application
    Filed: February 14, 2002
    Publication date: August 14, 2003
    Inventors: Noyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
  • Publication number: 20030146809
    Abstract: A wide bandwidth bias tee including a high frequency terminal, a first resistor coupled between the high frequency terminal and a capacitor, a second resistor coupled to the capacitor, the second resistor coupled in series with the first resistor, and a low frequency terminal, the low frequency terminal coupled to the second resistor.
    Type: Application
    Filed: February 1, 2002
    Publication date: August 7, 2003
    Inventors: M. Tekamul Buber, Adil Khalil, Robert Ian Gresham