Patents by Inventor M. Tekamul Buber
M. Tekamul Buber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10979016Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.Type: GrantFiled: December 12, 2019Date of Patent: April 13, 2021Assignee: Maury Microwave, Inc.Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Patent number: 10651528Abstract: A directional coupler operable at microwave and RF frequencies. Embodiments of directional coupler includes a main transmission line supporting transverse electromagnetic (TEM) or quasi-TEM wave mode propagation. A coupled transmission line supports TEM or quasi-TEM wave mode propagation. The coupled transmission line is adjacent to and oriented at an angle with respect to the main transmission line. A coupling hole is formed through conductive shielding between the main and coupled lines, the coupling hole formed at an intersection region between the main and coupled lines. The angle is nominally 60 degrees for optimal directivity and isolation.Type: GrantFiled: November 27, 2017Date of Patent: May 12, 2020Assignee: Maury Microwave, Inc.Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Patent number: 10652051Abstract: A load pull system and method for calibrating the system and conducting measurements on a Device Under Test (DUT). The system includes at least one passive tuner; and a modulated signal connected to the DUT input. The passive tuner is calibrated at multiple frequencies within the modulation bandwidth of the modulated signal. The impedance and measured quantities such as power at the DUT reference plane are determined using tuner s-parameters at multiple frequencies within the modulation bandwidth.Type: GrantFiled: August 28, 2018Date of Patent: May 12, 2020Assignee: Maury Microwave, Inc.Inventors: Gary R. Simpson, Sathya Padmanabhan, Steven M. Dudkiewicz, M. Tekamül Büber, Giampiero Esposito
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Publication number: 20200119707Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. The multi- section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.Type: ApplicationFiled: December 12, 2019Publication date: April 16, 2020Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Patent number: 10560067Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. Each section of the multi-section probe has a nominal length equal to one quarter wavelength at a midpoint of the operating band. The tapered probe has a length equivalent to a plurality of one quarter wavelengths of the frequency midpoint. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.Type: GrantFiled: January 17, 2018Date of Patent: February 11, 2020Assignee: Maury Microwave, Inc.Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Publication number: 20190222191Abstract: A multi-section probe and a tapered probe for impedance tuners to broaden the band width of the probes and hence the band width of the tuners. Each section of the multi-section probe has a nominal length equal to one quarter wavelength at a midpoint of the operating band. The tapered probe has a length equivalent to a plurality of one quarter wavelengths of the frequency midpoint. The multi-section probe and the tapered probe are configured to transform the characteristic impedance of the tuner transmission line step-by-step or continuously to a target impedance value.Type: ApplicationFiled: January 17, 2018Publication date: July 18, 2019Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Publication number: 20190165445Abstract: A directional coupler operable at microwave and RF frequencies. Embodiments of directional coupler includes a main transmission line supporting transverse electromagnetic (TEM) or quasi-TEM wave mode propagation. A coupled transmission line supports TEM or quasi-TEM wave mode propagation. The coupled transmission line is adjacent to and oriented at an angle with respect to the main transmission line. A coupling hole is formed through conductive shielding between the main and coupled lines, the coupling hole formed at an intersection region between the main and coupled lines. The angle is nominally 60 degrees for optimal directivity and isolation.Type: ApplicationFiled: November 27, 2017Publication date: May 30, 2019Inventors: M. Tekamül Büber, Sathya Padmanabhan
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Publication number: 20190081822Abstract: A load pull system and method for calibrating the system and conducting measurements on a Device Under Test (DUT). The system includes at least one passive tuner; and a modulated signal connected to the DUT input. The passive tuner is calibrated at multiple frequencies within the modulation bandwidth of the modulated signal. The impedance and measured quantities such as power at the DUT reference plane are determined using tuner s-parameters at multiple frequencies within the modulation bandwidth.Type: ApplicationFiled: August 28, 2018Publication date: March 14, 2019Inventors: Gary R. Simpson, Sathya Padmanabhan, Steven M. Dudkiewicz, M. Tekamül Büber, Giampiero Esposito
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Patent number: 9614267Abstract: Embodiments of a broadband capacitor in a coaxial line are described. A capacitor may be realized in the center conductor of the coaxial line, and this aspect has two different embodiments. One embodiment forms the capacitor between the flat faces of an interrupted inner conductor structure. A second embodiment forms the capacitor between overlapping fingers of the female inner conductor and the male inner conductor, where the fingers can be realized in different ways. In another embodiment, a capacitor is realized in the outer conductor of the coaxial line, between fingers of a female portion of the outer conductor and a male portion of the outer conductor, where the fingers can be realized in different ways.Type: GrantFiled: May 16, 2016Date of Patent: April 4, 2017Assignee: Maury Microwave, Inc.Inventors: M. Tekamül Büber, Sathya Padmanabhan, Bruce J. Pluth
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Patent number: 8414720Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.Type: GrantFiled: June 21, 2010Date of Patent: April 9, 2013Assignee: Weyerhaeuser NR CompanyInventors: Mark T. Churchland, M. Tekamul Buber
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Publication number: 20110308695Abstract: The present disclosure includes systems and methods for manufacturing a composite wood product. In some embodiments, the method includes the steps of forming a mat from a plurality of wood elements and an adhesive, the mat having a width W measured substantially perpendicular to a longitudinal axis of the mat and an initial thickness T1. The mat is then moved in a machine direction, the machine direction being substantially parallel to the longitudinal axis and the temperature across the width W of the mat is adjusted. The mat is then compressed into a billet having a final thickness T2. In some embodiments, the system includes a continuous movement mechanism, a side preheat assembly, and a press assembly.Type: ApplicationFiled: June 21, 2010Publication date: December 22, 2011Applicant: WEYERHAEUSER NR COMPANYInventors: Mark T. Churchland, M. Tekamul Buber
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Patent number: 6891266Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.Type: GrantFiled: February 14, 2002Date of Patent: May 10, 2005Assignee: MIA-comInventors: Noyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
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Patent number: 6657522Abstract: A wide bandwidth bias tee including a high frequency terminal, a first resistor coupled between the high frequency terminal and a capacitor, a second resistor coupled to the capacitor, the second resistor coupled in series with the first resistor, and a low frequency terminal, the low frequency terminal coupled to the second resistor.Type: GrantFiled: February 1, 2002Date of Patent: December 2, 2003Assignee: M/A-ComInventors: M. Tekamul Buber, Adil Khalil, Robert Ian Gresham
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Publication number: 20030151133Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.Type: ApplicationFiled: February 14, 2002Publication date: August 14, 2003Inventors: Noyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
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Publication number: 20030146809Abstract: A wide bandwidth bias tee including a high frequency terminal, a first resistor coupled between the high frequency terminal and a capacitor, a second resistor coupled to the capacitor, the second resistor coupled in series with the first resistor, and a low frequency terminal, the low frequency terminal coupled to the second resistor.Type: ApplicationFiled: February 1, 2002Publication date: August 7, 2003Inventors: M. Tekamul Buber, Adil Khalil, Robert Ian Gresham