Patents by Inventor M. Webb

M. Webb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050127490
    Abstract: Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.
    Type: Application
    Filed: December 16, 2003
    Publication date: June 16, 2005
    Inventors: Bryan Black, Nicholas Samra, M. Webb