Patents by Inventor Ma Su Su HLAING

Ma Su Su HLAING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUB-FIELD CONTROL OF A LITHOGRAPHIC PROCESS AND ASSOCIATED APPARATUS
    Publication number: 20230288817
    Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 14, 2023
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Rowin MEIJERINK, Putra SAPUTRA, Pieter Gerardus Jacobus SMORENBERG, Theo Wilhelmus Maria THIJSSEN, Khalid ELBATTAY, Ma Su Su HLAING, Paul DERWIN, Bo ZHONG, Masaya KOMATSU
  • Sub-field control of a lithographic process and associated apparatus
    Patent number: 11662666
    Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: May 30, 2023
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Rowin Meijerink, Putra Saputra, Pieter Gerardus Jacobus Smorenberg, Theo Wilhelmus Maria Thijssen, Khalid Elbattay, Ma Su Su Hlaing, Paul Derwin, Bo Zhong, Masaya Komatsu
  • SUB-FIELD CONTROL OF A LITHOGRAPHIC PROCESS AND ASSOCIATED APPARATUS
    Publication number: 20220171295
    Abstract: A method for controlling a lithographic apparatus configured to pattern an exposure field on a substrate including at least a sub-field, the method including: obtaining an initial spatial profile associated with a spatial variation of a performance parameter associated with a layer on the substrate across at least the sub-field of the exposure field; and decomposing the initial spatial profile into at least a first component spatial profile for controlling a lithographic apparatus at a first spatial scale and a second component spatial profile for controlling the lithographic apparatus at a second spatial scale associated with a size of the sub-field, wherein the decomposing includes co-optimizing the first and second component spatial profiles based on correcting the spatial variation of the performance parameter across the sub-field.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 2, 2022
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Rowin MEIJERINK, Putra SAPUTRA, Pieter Gerardus Jacobus SMORENBERG, Theo Wilhelmus Maria THIJSSEN, Khalid ELBATTAY, Ma Su Su HLAING, Paul DERWIN, BO ZHONG, Masaya KOMATSU