Patents by Inventor Ma Yiyi

Ma Yiyi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer level through-hole plugging using mechanical forming technique
    Publication number: 20060009029
    Abstract: A wafer is provided having at least one through-hole therein. The at least one through-hole is filled with one or more conductive balls. Thereafter, the wafer is compressed wherein the one or more conductive balls form a conductive plug in the at least one through-hole. After forming the conductive plug in one or more wafers, the wafers can be joined to form a three-dimensional system.
    Type: Application
    Filed: April 22, 2005
    Publication date: January 12, 2006
    Inventors: Wong Hua, Chong Choong, Ma Yiyi