Abstract: A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.