Patents by Inventor Maarten Jeroen Van Dort

Maarten Jeroen Van Dort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via network structures and method therefor
    Patent number: 8896124
    Abstract: A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: November 25, 2014
    Assignee: NXP B.V.
    Inventors: Yuan Li, Som Nath, Maarten Jeroen Van Dort