Abstract: A micro-electromechanical system (MEMS) device includes a silicon substrate; and a Tantalum (Ta) layer comprising a first portion and a second portion, a first portion being suspended over the silicon substrate and configured to move relative to the silicon substrate, and the second portion of the structure being coupled to the silicon substrate and fixed in place relative to the silicon substrate. MEMS devices including accelerometers, gyroscopes, microphones, etc. can be fabricated in which Ta forms the structure material of the MEMS components on a chip. The Ta and integrated circuit (IC) can be fabricated together in a single package in which the MEMS structure is able to use the full area above the IC in the package.

Abstract: A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.

Abstract: A full-field imaging, long working distance, incoherent interference microscope suitable for three-dimensional imaging and metrology of MEMS devices and test structures on a standard microelectronics probe station. A long working distance greater than 10 mm allows standard probes or probe cards to be used. This enables nanometer-scale 3-dimensional height profiles of MEMS test structures to be acquired across an entire wafer while being actively probed, and, optionally, through a transparent window. An optically identical pair of sample and reference arm objectives is not required, which reduces the overall system cost, and also the cost and time required to change sample magnifications. Using a LED source, high magnification (e.g., 50×) can be obtained having excellent image quality, straight fringes, and high fringe contrast.

Abstract: An apparatus and method for separating a thin film from a substrate, the thin film having a surface with a selected width, includes an indenter for applying a force to the surface of the thin film that is substantially equal along the selected width. The forces are applied until separation of a portion of the thin film from the substrate occurs. In a preferred embodiment, the indenter is made from a block of material having a substantially flat surface engageable with the surface of the thin film. The substantially flat surface of the block of material has a width at least equal to the width of the surface of the thin film. Based on the two dimensional geometry of the mechanics, accurate analysis of work of adhesion is achieved.