Patents by Inventor Maarten van Dort

Maarten van Dort has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via network structures and method therefor
    Patent number: 9269617
    Abstract: A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: February 23, 2016
    Assignee: NXP B.V.
    Inventors: Yuan Li, Som Nath, Maarten van Dort
  • VIA NETWORK STRUCTURES AND METHOD THEREFOR
    Publication number: 20150072520
    Abstract: A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
    Type: Application
    Filed: October 15, 2014
    Publication date: March 12, 2015
    Inventors: Yuan Li, Som Nath, Maarten van Dort
  • VIA NETWORK STRUCTURES AND METHOD THEREFOR
    Publication number: 20120248623
    Abstract: A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.
    Type: Application
    Filed: April 4, 2011
    Publication date: October 4, 2012
    Inventors: Yuan Li, Som Nath Nath, Maarten van Dort