Abstract: A target space ratio of a monitor pattern on a substrate for inspection is determined to be different from a ratio of 1:1. A range of space ratios in a library is determined to include the target space ratio and not include a space ratio of 1:1. The monitor pattern is formed on a film to be processed by performing predetermined processes on the substrate for inspection. Sizes of the monitor pattern are measured. The sizes of the monitor pattern are converted into sizes of a pattern of the film to be processed having a space ratio of 1:1, and processing conditions of the predetermined processes are compensated for based on the sizes of the converted pattern of the film to be processed. After that, the predetermined processes are performed on a wafer under the compensated conditions to form a pattern having a space ratio of 1:1 on the film to be processed.

Abstract: The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.

Abstract: A target space ratio of a monitor pattern on a substrate for inspection is determined to be different from a ratio of 1:1. A range of space ratios in a library is determined to include the target space ratio and not include a space ratio of 1:1. The monitor pattern is formed on a film to be processed by performing predetermined processes on the substrate for inspection. Sizes of the monitor pattern are measured. The sizes of the monitor pattern are converted into sizes of a pattern of the film to be processed having a space ratio of 1:1, and processing conditions of the predetermined processes are compensated for based on the sizes of the converted pattern of the film to be processed. After that, the predetermined processes are performed on a wafer under the compensated conditions to form a pattern having a space ratio of 1:1 on the film to be processed.

Abstract: A roughness evaluation method for evaluating a roughness of lines formed on a substrate includes a measuring step of irradiating light onto a plurality of locations of the substrate and measuring a state of reflected light by a scatterometry; and an analyzing step of evaluating the roughness of the lines based on a variation in value measured in the measuring step. A roughness evaluation system includes an optical device for irradiating light onto the substrate and measuring a state of reflected light by a scatterometry; a moving device for moving the substrate in at least one of an x-direction and a y-directions on a horizontal plane; a controller for controlling the moving device such that the optical device measures a plurality of locations on the substrate; and an analysis unit for evaluating the roughness based on a variation in measured values at the plurality of locations on the substrate.

Abstract: The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.

Abstract: A roughness evaluation method for evaluating a roughness of lines formed on a substrate includes a measuring step of irradiating light onto a plurality of locations of the substrate and measuring a state of reflected light by a scatterometry; and an analyzing step of evaluating the roughness of the lines based on a variation in value measured in the measuring step. A roughness evaluation system includes an optical device for irradiating light onto the substrate and measuring a state of reflected light by a scatterometry; a moving device for moving the substrate in at least one of an x-direction and a y-directions on a horizontal plane; a controller for controlling the moving device such that the optical device measures a plurality of locations on the substrate; and an analysis unit for evaluating the roughness based on a variation in measured values at the plurality of locations on the substrate.

Abstract: The present invention is a processing method including a processing step of performing predetermined processing for a workpiece; an unnecessary portion removal step of removing an unnecessary portion produced on a surface of the workpiece due to the predetermined processing; and a surface structure evaluation step of evaluating a surface structure of the workpiece from which the unnecessary portion has been removed by the unnecessary portion removal step.