Abstract: A cleaning method for removing a rosin-base solder flux, the method including bringing a cleaning agent into contact with the flux on a printed wiring board, the cleaning agent including a mixture of(A) at least one glycol ether compound represented by the formula ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R.sup.2 is an alkyl group having 1 to 5 carbon atoms, R.sup.3 is a hydrogen atom or a methyl group and n is an integer of 2 to 4, and(B) at least one nonionic surfactant.

Abstract: The invention provides a cleaning method for removing a rosin-base solder flux, using essentially a mixture of(A) a compound of the formula (1) ##STR1## wherein R.sup.1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R.sup.2 is an alkyl group having 1 to 5 carbon atoms, R.sup.3 is a hydrogen atom or a methyl group and k is an integer of 2 to 4,(B) a compound represented by the formula (2)R.sup.4 --O--(CH.sub.2 CH.sub.2 O).sub.m --H (2)wherein R.sup.4 is a straight- or branched-chain alkyl group having 6 to 20 carbon atoms, phenyl group or a phenyl group substituted with a straight- or branched- chain alkyl group having 7 to 12 carbon atoms and m is an integer 2 to 20,(C) a compound represented by the formula (3) ##STR2## wherein R.sup.

Abstract: The invention provides a cleaning agent for removal of a rosin-base flux, the cleaning agent consisting essentially of a surfactant represented by the formulaR--O--(CH.sub.2 CH.sub.2 O).sub.n --H (I)wherein R is a straight or branched chain alkyl or alkenyl group having 5 to 18 carbon atoms and n is an integer of 2 to 12, and a cleaning method for removing a rosin-base flux, the method comprising bringing the cleaning agent into contact with a flux on a printed wiring board.

Abstract: A composition useful as an alkaline developable liquid photoimageable solder resist ink comprising a photocurable resin, a photopolymerization initiator, a reactive diluent, a solvent and optionally, a thermosetting material as main components wherein the photocurable resin comprises a reaction product of: (A) an epoxy vinyl ester resin obtained by reacting a cresol novolak epoxy resin and an unsaturated monobasic acid, (B) a polybasic acid anhydride and (C) an alkyl ketene dimer, wherein the hydroxyl value of the photocurable resin is not more than 10 carbons. Coating films formed from the subject composition have excellent adhesion, heat resistance, moisture insulation resistance and alkaline developable properties.

Abstract: A hydrogenated copolymer of a cyclopentadiene and an ethylenically unsaturated ester having a softening point of up to 150.degree. C, an iodine value of 0 to 50, a saponification value of 4 to 330, a number average molecular weight of 200 to 800 and a ratio of weight average molecular weight to number average molecular weight of 1 to 2.5; and a hotmelt composition and pressure sensitive adhesive composition containing the above hydrogenated copolymer as a tackifier.