Patents by Inventor Maciej Patelka
Maciej Patelka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10590319Abstract: A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.Type: GrantFiled: July 15, 2016Date of Patent: March 17, 2020Assignee: NAMICS CORPORATIONInventors: Cathy Shaw Trumble, Maciej Patelka, Noriyuki Sakai, Nicholas C. Krasco
-
Patent number: 10290601Abstract: A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.Type: GrantFiled: April 6, 2016Date of Patent: May 14, 2019Assignee: NAMICS CORPORATIONInventors: Raymond Dietz, Cathy Shaw Trumble, Maciej Patelka, Akito Yoshii, Noriyuki Sakai, Hiroshi Yamaguchi
-
Publication number: 20180251663Abstract: A composition including (a) 20 to 85 wt % of a thermally conductive silver component containing silver nano-particles having a particle diameter of 5 to 500 nanometers; (b) a polyorgano-silsesquioxane component, the polyorganosilsesquioxane component selected from the group consisting of (i) 0.5 to 12 wt % of a polyorganosilsesquioxane fine powder, (ii) 0.5 to 8 wt % of a copolymer powder containing an interlacing polymer network of (I) a polyorganosilsesquioxane and (II) a polydiorganosiloxane; and (iii) 0.5 to 12 wt % of a combination of the polyorgano-silsesquioxane fine powder and the copolymer powder; and (c) 3 to 12 wt % of a total solvent content in the form of (i) one or more solvents, (ii) a vehicle containing one or more solvents, or (iii) a combination thereof.Type: ApplicationFiled: July 15, 2016Publication date: September 6, 2018Applicant: NAMICS CORPORATIONInventors: Cathy Shaw TRUMBLE, Maciej PATELKA, Noriyuki SAKAI, Nicholas C. KRASCO
-
Publication number: 20180082972Abstract: A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.Type: ApplicationFiled: April 6, 2016Publication date: March 22, 2018Applicant: NAMICS CORPORATIONInventors: Raymond DIETZ, Cathy Shaw TRUMBLE, Maciej PATELKA, Akito YOSHII, Noriyuki SAKAI, Hiroshi YAMAGUCHI
-
Patent number: 9776909Abstract: A glass frit having a low melting point containing (A) Ag2O, (B) V2O5, and (C) at least one first oxide selected from the group consisting of MoO3, ZnO, CuO, TiO2, Bi2O3, MnO2, MgO, Nb2O5, BaO and P2O5. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (Ag2O/V2O5) of (A) to (B) of 1.8 to 3.2.Type: GrantFiled: January 28, 2014Date of Patent: October 3, 2017Assignee: NAMICS CORPORATIONInventors: Raymond Dietz, Maciej Patelka, Noriyuki Sakai, Hiroshi Yamaguchi
-
Patent number: 9540275Abstract: A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360° C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) Ag2O, (B-2) V2O5, and (B-3) MoO3. The conductive paste can achieve binding at a relatively low temperature (such as 370° C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360° C.).Type: GrantFiled: January 15, 2015Date of Patent: January 10, 2017Assignee: NAMICS CORPORATIONInventors: Raymond Dietz, Maciej Patelka, Cathy Shaw Trumble, Noriyuki Sakai, Hiroshi Yamaguchi
-
Publication number: 20160326044Abstract: A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360° C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) Ag2O, (B-2) V2O5, and (B-3) MoO3. The conductive paste can achieve binding at a relatively low temperature (such as 370° C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360° C.).Type: ApplicationFiled: January 15, 2015Publication date: November 10, 2016Applicant: NAMICS CORPORATIONInventors: Raymond Dietz, Maciej Patelka, Cathy Shaw Trumble, Noriyuki Sakai, Hiroshi Yamaguchi
-
Publication number: 20160052820Abstract: A glass frit having a low melting point containing (A) Ag2O, (B) V2O5, and (C) at least one first oxide selected from the group consisting of MoO3, ZnO, CuO, TiO2, Bi2O3, MnO2, MgO, Nb2O5, BaO and P2O5. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (Ag2O/V2O5) of (A) to (B) of 1.8 to 3.2.Type: ApplicationFiled: January 28, 2014Publication date: February 25, 2016Applicant: NAMICS CORPORATIONInventors: Raymond DIETZ, Maciej PATELKA, Noriyuki SAKAI, Hiroshi YAMAGUCHI
-
Patent number: 8344523Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.Type: GrantFiled: July 30, 2009Date of Patent: January 1, 2013Assignee: Diemat, Inc.Inventors: Raymond L. Dietz, Maciej Patelka, Akito Yoshii, Pawel Czubarow, Takashi Sakamoto, Yukinari Abe
-
Patent number: 7906373Abstract: Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.Type: GrantFiled: March 26, 2008Date of Patent: March 15, 2011Inventors: Pawel Czubarow, Raymond L Dietz, Maciej Patelka
-
Publication number: 20100065790Abstract: Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (<200 nm) particles. The compositions exhibit increased thermal conductivity.Type: ApplicationFiled: July 30, 2009Publication date: March 18, 2010Applicant: DIEMATInventors: Raymond L. Dietz, Maciej Patelka, Akito Yoshii, Pawel Czubarow, Takashi Sakamoto, Yukinari Abe
-
Publication number: 20070256783Abstract: An adhesive paste with rounded filler particles results in improved thermal properties. The resultant compound maintains excellent quality for bonding high density, microcircuit electronic components to substrates.Type: ApplicationFiled: May 8, 2007Publication date: November 8, 2007Inventors: Raymond L. Dietz, Maciej Patelka
-
Publication number: 20060167383Abstract: Methods and systems for detecting occult blood and other analytes in the water of a toilet bowl release a dye reagent into the water which produces an observable signal in the presence of the blood or other selected analytes. The dye reagent is preferably dispersed as a liquid, powder, gel, or other form which rapidly mixes and combines with the sample. Additionally, the water of a toilet bowl will have a reduced impurity content such as iron and a surfactant is used to help liberate the analyte from a stool sample. Usually, automatic mechanical or electromechanical dispensing systems are used to release the dye reagent and surfactant into the water.Type: ApplicationFiled: March 27, 2006Publication date: July 27, 2006Inventors: Maciej Kieturakis, Paul Czubarow, Maciej Patelka