Abstract: Imidazoline compounds of formula ##STR1## where n denotes 2 or 3, is suitable as cure accelerator in curable epoxide resin compositions comprising a latent curing agent.

Abstract: Adducts of the formula I ##STR1## are described in which R.sup.1 is an e-valent aliphatic radical after the removal of the functional groups, X is --O--or --NH--, R.sup.2 is a d+l-valent carbocyclic-aromatic radical, R.sup.3 is hydrogen or methyl, R.sup.4 is an aliphatic, aromatic, or araliphatic c+l-valent radical, Y is --O--, --S--or --NR.sup.5 --, R.sup.5 is hydrogen or ##STR2## b is an integer from 2 to 15, b is an integer from 1 to 25, c is 1, 2 or 3, d is 1, 2 or 3 and e is 2, 3 or 4.The adducts can be combined with latent curing agents and, if appropriate, other epoxy resins to give adhesives having good stability on storage and high flexibility.

Abstract: Curable compositions comprise(A) a polyglycidyl ether of a polyhydric phenol,(B) a polyglycidyl ether of a polyhydric alcohol,(C) a nitrogen-containing latent hardener for epoxide resins and(D) as cure accelerator dispersed as a powder in the composition, a solid solution of a polymeric phenol with an aliphatic polyamine having two or more amine groups, each of the amine groups being tertiary and at least two of the amine groups being dimethylamino groups.

Abstract: Imidazoline compounds of formula ##STR1## where n denotes 2 or 3, is suitable as cure accelerator in curable epoxide resin compositions comprising a latent curing agent.

Abstract: Curable compositions comprise(A) a polyglycidyl ether of a polyhydric phenol,(B) a polyglycidyl ether of a polyhydric alcohol,(C) a nitrogen-containing latent hardener for epoxide resins and(D) as cure accelerator dispersed as a powder in the composition, a solid solution of a polymeric phenol with an aliphatic polyamine having two or more amine groups, each of the amine groups being tertiary and at least two of the amine groups being dimethylamino groups.The compositions are useful as adhesives, sealants, laminating resins and coatings.

Abstract: Curable liquid compositions comprise(A) a liquid epoxide resin and(B) as curing agent for (A), more than 10% by weight, based on the weight of (A), of a solid solution of a polymeric phenol, such as a polymer of p-vinyl phenol or a phenolic novolak resin, and a polyamine having at least one primary amine group, such as diethylenetriamine or triethylenetetramine, the solid solution (B) being disposed as a powder in the epoxide resin. The compositions are useful as adhesives.

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

Abstract: Adhesion between surfaces of metal, reinforced plastics, glass, friction material or ceramics is effected using an adhesive comprising(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide, isophthalic acid dihydrazide or adipic acid dihydrazide, and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a phenol-aldehyde resin.Typical nitrogen bases used in (c) include benzyldimethylamine, benzimidazole and 2-methylimidazole. Typical phenolic resins are those prepared from phenol and formaldehyde.

Abstract: Compositions useful as adhesives, sealants, laminating resins and coatings comprise(a) an epoxide resin(b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and(c) as accelerator for the cure, and dispersed as a powder in (a) and (b), a solid solution of a nitrogen base having a boiling point above 130.degree. C. and a polymer of an unsaturated phenol.Typical nitrogen bases used in (c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).

Abstract: New epoxide resins have the formula ##STR1## where R represents a phenylene or naphthylene group, or two or three phenylene groups linked by carbon-carbon bonds, oxygen or sulfur atoms, sulfonyl or sulfoxide groups, or alkylene groups of 1 to 5 carbon atoms, the phenylene or naphthylene group(s) being optionally substituted by chlorine or bromine atoms or lower alkyl groups, andR.sup.1 represents an alkyl group of up to 16 carbon atoms; an alkenyl group of up to 6 carbon atoms; a phenyl, naphthyl, phenylalkyl, or naphthylalkyl group, all optionally substituted by chlorine or bromine atoms, and the phenyl and naphthyl groups in addition optionally by lower alkyl groups; or a cycloalkyl or cycloalkylalkyl group.The products, typical examples of which are 2,2-bis(p-(3-butoxy-2-glycidyloxypropyloxy)phenyl)propane and bis(p-(3-butoxy-2-glycidyloxypropyloxy)phenyl) sulfone, are generally of low viscosity and useful as casting resins.

Abstract: Powder coating compositions comprise an epoxide resin and a carboxylic acid of formula ##STR1## where R.sup.1 represents a phenylene or naphthylene group or a group comprising 2 or 3 phenylene radicals linked by one or two carbon-carbon bonds, ether oxygen atoms, sulfur atoms, or sulfonyl, sulfoxide, carbonyl or alkylene groups,R.sup.2 represents a saturated alkyl group, a benzenoid group or an aralkyl group, andboth n are the same and represent zero or 1.