Patents by Inventor Madhu Deshpande

Madhu Deshpande has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for applying films using reduced deposition rates
    Patent number: 6324439
    Abstract: This invention provides a stable process for depositing films which include silicon and nitrogen, such as antireflective coatings of silicon oxynitride. Nitrogen is employed to permit lower flow rates of the process gas containing silicon, thereby reducing the deposition rate and providing better control of film thickness. Additionally, the use of nitrogen stabilizes the process, improving film uniformity, and provides a higher-quality film. The invention is capable of providing more accurate and easier fabrication of structures requiring uniformly thin films containing silicon, nitrogen, and, optionally, oxygen, such as antireflective coatings.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: November 27, 2001
    Assignee: Applied Materials, Inc.
    Inventors: David Cheung, Joe Feng, Madhu Deshpande, Wai-Fan Yau, Judy H. Huang
  • Method for applying films using reduced deposition rates
    Patent number: 6083852
    Abstract: This invention provides a stable process for depositing films which include silicon and nitrogen, such as antireflective coatings of silicon oxynitride. Nitrogen is employed to permit lower flow rates of the process gas containing silicon, thereby reducing the deposition rate and providing better control of film thickness. Additionally, the use of nitrogen stabilizes the process, improving film uniformity, and provides a higher-quality film. The invention is capable of providing more accurate and easier fabrication of structures requiring uniformly thin films containing silicon, nitrogen, and, optionally, oxygen, such as antireflective coatings.
    Type: Grant
    Filed: May 7, 1997
    Date of Patent: July 4, 2000
    Assignee: Applied Materials, Inc.
    Inventors: David Cheung, Joe Feng, Madhu Deshpande, Wai-Fan Yau, Judy H. Huang