Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: High speed waveguide-based data communication systems are disclosed. Such systems may include separable electrical connectors, forming signal propagation paths between electronic assemblies with one or more waveguides.

Abstract: An electrical connector has a row of signal contacts, and a ground shield disposed inwardly from the signal contacts. Each of the signal and ground contacts has a first segment and a second segment. Each first segment defines a mounting end that can mount to a first electrical component, and each second segment defines a mating end that can mate with a second electrical component. The first and second segments of each signal contact and the ground contact are angularly offset from one another so as to define an angle of between 75 degrees and 105 degrees between the first and second segments. The first and second segments of each signal contact and the ground contact can be coupled to one another to define the angle. Alternatively, the signal and ground contacts can be bent along a common bend line that intersects the signal contacts and the ground contact.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: An electrical connector configured for differential pairs with low in-pair skew. The connector may comprise lead frame assemblies, such as insert molded lead frame assemblies, with adjacent conductors configured for reduced skew by distributing skew correction throughout the transmission path through the lead frame assembly. Elongated air gaps are formed in a side of the housing, exposing the longer conductor of each pair. The elongated air gap may span the entire length of the arc of a longer conductor of each pair. The width of this air gap may be different for different pairs in the lead frame assembly and may be selected to cancel or prevent in-pair skew from arising. The width for each pair may be selected to tune the effective dielectric constant of the longer conductor such that its electrical length matches that of the shorter conductor.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: An electrical connector having one or more openings formed in the connector's housing between adjacent rows of conductors. The openings may be positioned between rows of contact portions, and reduces crosstalk between conductors in adjacent rows. The opening(s) may extend through the entire length of the connector's housing. The opening(s) may have any suitable shape. In some embodiments, the openings may comprise a slot, bifurcated by crossbeams. The crossbeams may have ends positioned between signal conductors in the same row of the same type, either signal or ground. Alternatively or additionally, the crossbeams may be angled with respect to the rows of contacts such that the ends are positioned proximate conductors of a first type in one row and proximate conductors of a second type in another row.

Abstract: A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.

Abstract: An electrical connector configured for differential pairs with low in-pair skew. The connector may comprise lead frame assemblies, such as insert molded lead frame assemblies, with adjacent conductors configured for reduced skew by distributing skew correction throughout the transmission path through the lead frame assembly. Elongated air gaps are formed in a side of the housing, exposing the longer conductor of each pair. The elongated air gap may span the entire length of the arc of a longer conductor of each pair. The width of this air gap may be different for different pairs in the lead frame assembly and may be selected to cancel or prevent in-pair skew from arising. The width for each pair may be selected to tune the effective dielectric constant of the longer conductor such that its electrical length matches that of the shorter conductor.

Abstract: A connector for surface mounting with a solder reflow process with closely-spaced solder masses on mounting ends of reference contacts. The solder masses on the reference contacts may fuse for enhanced shielding. The mounting ends of signal and reference contacts may be positioned in rows, configured such that the solder masses of the reference contacts may shield solder masses attached to signal contacts in adjacent rows. The mounting ends of the signal contacts may be disposed in pockets in a surface of the connector housing. In some embodiments, solder balls may be fused to an edge of the signal contact, with the length of the edge extending beyond locations at which the solder ball is fused to. The edge may extend through a wall of the pocket, so as to set a desired impedance in the mounting region of the connector.

Abstract: A connector for surface mounting with a solder reflow process with solder masses fused to mounting ends of contacts exposed in a mounting surface of the connector. The solder masses may be attached to edges of the mounting ends using a pin transfer method to apply flux to the edges. The edges may have a concave shape to both increase the length of the edge to which the solder masses are attached and position the solder masses with respect to the mounting ends. Solder paste may be omitted in attaching the solder balls to the contacts, reducing the capacitance of the contact and promoting uniformity of the impedance of the signal paths through the mounting interface of the connector.

Abstract: An electrical connector having one or more openings formed in the connector's housing between adjacent rows of conductors. The openings may be positioned between rows of contact portions, and reduces crosstalk between conductors in adjacent rows. The opening(s) may extend through the entire length of the connector's housing. The opening(s) may have any suitable shape. In some embodiments, the openings may comprise a slot, bifurcated by crossbeams. The crossbeams may have ends positioned between signal conductors in the same row of the same type, either signal or ground. Alternatively or additionally, the crossbeams may be angled with respect to the rows of contacts such that the ends are positioned proximate conductors of a first type in one row and proximate conductors of a second type in another row.

Abstract: An electrical connector footprint on a printed circuit board (PCB) can include vias and antipads surrounding those vias. While conventional antipads surrounding vias are large in order to improve impedance of the PCB, the presence of the antipads can compromise the integrity of the ground plane and can permit cross talk to arise between differential pairs on different layers in the PCB. Antipads can be constructed and arranged so as to limit cross talk between layers in a PCB, while also maximizing impedance.

Abstract: Electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to an underlying substrate are provided. Certain of the electrical connectors can be configured to be mounted to a substrate configured in accordance with the MicroTCA® press fit footprint. Additionally, electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to respective alternative footprints, and substrates configured in accordance with the respective alternative footprints are provided. The disclosed electrical connectors and corresponding substrate footprints can operate to transmit data at speed up to and in excess of 25 Gigabits per second.

Abstract: Electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to an underlying substrate are provided. Certain of the electrical connectors can be configured to be mounted to a substrate configured in accordance with the MicroTCA® press fit footprint. Additionally, electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to respective alternative footprints, and substrates configured in accordance with the respective alternative footprints are provided. The disclosed electrical connectors and corresponding substrate footprints can operate to transmit data at speed up to and in excess of 25 Gigabits per second.

Abstract: Electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to an underlying substrate are provided. Certain of the electrical connectors can be configured to be mounted to a substrate configured in accordance with the MicroTCA® press fit footprint. Additionally, electrical connectors that are mating compatible with the MicroTCA® standard and configured to be mounted to respective alternative footprints, and substrates configured in accordance with the respective alternative footprints are provided. The disclosed electrical connectors and corresponding substrate footprints can operate to transmit data at speed up to and in excess of 25 Gigabits per second.