Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Abstract: A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.

Abstract: A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.

Abstract: A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

Abstract: A tool is disclosed, for measuring the important thermal characteristics of a unit of electronic equipment, which obtains air flow and temperature readings at both air inlet and air outlet openings of the unit without disturbing cable or wiring connections or otherwise interrupting device operation. The tool pressure sensing element is rotatable between detented positions to permit the tool to be used at both air inlet and air outlet openings. The tool air duct portion may be formed of separate duct portions to enable a single duct portion including the sensing instrumentation to be used with multiple duct portions that conform to electronic device air inlet and outlet openings to impart added flexibility to the tool.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract: An isolation valve assembly, a coolant connect/disconnect assembly, a cooled multi-blade electronics center, and methods of fabrication thereof are provided employing an isolation valve and actuation mechanism. The isolation valve is disposed within at least one of a coolant supply or return line providing liquid coolant to the electronics subsystem. The actuation member is coupled to the isolation valve to automatically translate a linear motion, resulting from insertion of the electronics subsystem into the operational position within the electronics housing, into a rotational motion to open the isolation valve and allow coolant to pass. The actuation mechanism, which operates to automatically close the isolation valve when the liquid cooled electronics subsystem is withdrawn from the operational position, can be employed in combination with a compression valve coupling, with one fitting of the compression valve coupling being disposed serially in fluid communication with the isolation valve.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract: A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.

Abstract: A heat transfer apparatus and method of fabrication are provided for facilitating removal of heat from a heat generating electronic device. The heat transfer apparatus includes a thermally conductive base having a main surface, and a plurality of thermally conductive fins extending from the main surface. The thermally conductive fins are disposed to facilitate transfer of heat from the thermally conductive base, which can be a portion of the electronic device or a separate structure coupled to the electronic device. At least some conductive fins are composite structures, each including a first material coated with a second material, wherein the first material has a first thermal conductivity and the second material a second thermal conductivity. In one implementation, the thermally conductive fins are wire-bonded pin-fins, each being a discrete, looped pin-fin separately wire-bonded to the main surface and spaced less than 300 micrometers apart in an array.

Abstract: A method and incorporated hybrid air and liquid cooled module for cooling electronic components of a computing system is disclosed. The module is used for cooling electronic components and comprise a closed loop liquid cooled assembly in thermal communication with an air cooled assembly, such that the air cooled assembly is at least partially included in the liquid cooled assembly.

Abstract: A heat exchange assembly for a cooling system, having first and second cooling loops, includes a housing with a first coolant inlet and outlet and a second coolant inlet and outlet, respectively coupling to the first and second cooling loops, and multiple heat exchange elements. Each heat exchange element includes a first set and a second set of coolant flow passages intersecting different pairs of parallel face surfaces of the elements, with the second set of flow passages extending in a transverse direction to the first set of flow passages. The heat exchange elements are disposed within the housing with the first set of flow passages oriented in a first common direction in fluid communication with the first coolant inlet and outlet and the second set of flow passages oriented in a second common direction in fluid communication with the second coolant inlet and outlet of the housing.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a planar support structure supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, coolant outlet and at least one coolant carrying channel disposed therebetween; and a manifold for distributing coolant to and exhausting coolant from the cold plates. The cooling apparatus also includes multiple flexible hoses connecting the coolant inlets of the cold plates to the manifold, as well as the coolant outlets to the manifold, with each hose segment being disposed between a respective cold plate and the manifold. A biasing mechanism biases the cold plates away from the manifold and towards the electronics components, and at least one fastener secures the manifold to the support structure, compressing the biasing mechanism, and thereby forcing the parallel coupled cold plates towards their respective electronics components to ensure good thermal interface.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.