Abstract: Provided is an imaging device including a light receiving portion including a plurality of photoelectric conversion elements arranged in a two-dimensional manner, and a spectral filter including a storage portion that stores a substance composed of a fluid or a gas, an inflow portion through which the substance flows into the storage portion, and an outflow portion through which the substance flows out from the storage portion, the spectral filter having a spectral characteristic corresponding to a refractive index of the substance, the spectral filter being each provided for one or more of the photoelectric conversion elements.

Abstract: An imaging device having a multiband is provided. The imaging device includes a first photoelectric conversion element; a second photoelectric conversion element; a fixed mirror and a first moving mirror provided in correspondence to the first photoelectric conversion element and having reflective surfaces respectively facing each other with a first interval; a fixed mirror and a second moving mirror provided in correspondence to the second photoelectric conversion element and having reflective surfaces respectively facing each other with a second interval, the second moving mirror being coupled to the first moving mirror; and a driving member configured to move the first moving mirror and the second moving mirror relative to the fixed mirror.

Abstract: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.

Abstract: A variable capacitor including a first electrode part, which is provided at a fixed part that includes a substrate, and a movable part, which has a second electrode part forming the capacity of said variable capacitor between itself and the first electrode part, and the movable part is displaced in response to a first drive signal to selectively go into an opposing status, in which the second electrode part opposes the first electrode part, and a non-opposing status, in which the second electrode part essentially does not oppose the first electrode part. This variable capacitor is able to obtain at least a two-value capacity in which the mutual ratio is large without specially requiring another capacitor or a switch, and it is able to obtain the desired capacity variation range by combining a plurality of capacitors.

Abstract: A variable capacitor including a first electrode part, which is provided at a fixed part that includes a substrate, and a movable part, which has a second electrode part forming the capacity of said variable capacitor between itself and the first electrode part, and the movable part is displaced in response to a first drive signal to selectively go into an opposing status, in which the second electrode part opposes the first electrode part, and a non-opposing status, in which the second electrode part essentially does not oppose the first electrode part. This variable capacitor is able to obtain at least a two-value capacity in which the mutual ratio is large without specially requiring another capacitor or a switch, and it is able to obtain the desired capacity variation range by combining a plurality of capacitors.

Abstract: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.

Abstract: A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter ? of the optical system, the groove width Gw can be less than this value.

Abstract: A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter ? of the optical system, the groove width Gw can be less than this value.

Abstract: A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter &phgr; of the optical system, the groove width Gw can be less than this value.

Abstract: In a disk-shaped optical recording medium, in the program region and lead-out region, at least one of the track pitch and linear speed is slower than in the PCA region and PMA region. Because the track pitch and linear speed in the PCA region, PMA region and lead-in region are standard, the lead-in start radius, program start radius, and time from the lead-in start to the program region can be kept within the standard. On the other hand, in the program region, because at least one of the track pitch and linear speed is slower than in the standard case, the recording capacity of the program region can be increased. Accordingly, the optical recording medium can be utilized on standard drives without violating the standards imposed on the disk, and the recording capacity can be increased.

Abstract: A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter &phgr; of the optical system, the groove width Gw can be less than this value.

Abstract: A phase change type optical disk in which recording is performed in land portions and groove portions, and which eliminates the detrimental effects of narrowing of the track pitch. The optical disk includes a disk substrate having a refractive index n and performs recording in land portions and in groove portions using a phase change between amorphous and crystalline, with an illuminating light having wavelength &lgr;. A groove depth, which is the difference in level between a land portion and a groove portion, is limited in the range of numerical values of &lgr;/(3.78n) or greater. Moreover, the groove depth may be set to any value close to &lgr;/(3n), {&lgr;/(3n)+&lgr;/(2n)}, {&lgr;/(6n)+&lgr;/(2n)}. Furthermore, while the groove depth is made deep, the roughness width of the groove sidewalls is kept to 50 nm or less, or to 20 nm or less. Moreover, the taper angle of the groove sidewalls is set at 60° or more, 80° or more, or 84° or more.

Abstract: An optical disk is formed with grooves and lands for optically tracking an optical signal along a disk substrate. The lands and grooves are tracking guides on the surface of the disk substrate are coated with a recording film. The recording film varies in thickness over different portions of the tracking guides on the surface of the disk. A number of relationships and critical values may be determined by defining film thickness over the top of a land defined by (a), film thickness over a groove by (b), film thickness along a sidewall of a land by (c), groove depth from the top of a land to the bottom of a groove by (d1), and vertical film depth from the top of the film over a land to the top of the film over a groove by (d2). A difference in level (d2) of the recording film is preferably between 100-800 nm and a ratio (b/a) is preferably between 0.6-1.1. Also, a ratio (c/a) is preferably between 0-0.8.